AI Article Synopsis

  • - The study explores using low-temperature (LT) GaAs layers as a method to reduce dislocation defects in GaAs/Si heterostructures by investigating the effects of these layers and post-growth annealing.
  • - Results showed that introducing LT-GaAs layers and performing cyclic annealing significantly reduced dislocation density, surface roughness, and non-radiative recombination centers in the GaAs/Si regions.
  • - The improvements in the quality of near-surface GaAs layers are attributed to elastic deformations causing dislocation line bending and gallium vacancies diffusing into the GaAs layers, making these heterostructures suitable for high-quality light-emitting applications with quantum dots.

Article Abstract

The use of low-temperature (LT) GaAs layers as dislocation filters in GaAs/Si heterostructures (HSs) was investigated in this study. The effects of intermediate LT-GaAs layers and of the post-growth and cyclic in situ annealing on the structural properties of GaAs/LT-GaAs/GaAs/Si(001) HSs were studied. It was found that the introduction of LT-GaAs layers, in combination with post-growth cyclic annealing, reduced the threading dislocation density down to 5 × 10 cm, the root-mean-square roughness of the GaAs surface down to 1.1 nm, and the concentration of non-radiative recombination centers in the near-surface GaAs/Si regions down to the homoepitaxial GaAs level. Possible reasons for the improvement in the quality of near-surface GaAs layers are discussed. On the one hand, the presence of elastic deformations in the GaAs/LT-GaAs system led to dislocation line bending. On the other hand, gallium vacancies, formed in the LT-GaAs layers, diffused into the overlying GaAs layers and led to an increase in the dislocation glide rate. It was demonstrated that the GaAs/Si HSs obtained with these techniques are suitable for growing high-quality light-emitting HSs with self-assembled quantum dots.

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Source
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC9782000PMC
http://dx.doi.org/10.3390/nano12244449DOI Listing

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