AI Article Synopsis

  • Optical interconnects are emerging as a solution to improve data transfer limits in high-performance silicon chips, focusing on enhancing optical communication through wavelength-division multiplexing.
  • The study presents an integrated communication scheme that combines wavelength- and mode-multiplexing, achieving a significant 1.12-Tb/s data transmission without errors in a silicon nanophotonic waveguide.
  • Additionally, the approach employs inverse-designed couplers for efficient multimode optical transmission between different silicon chips, while ensuring compliance with standard silicon photonic foundry processes, making it scalable beyond current technologies.

Article Abstract

The use of optical interconnects has burgeoned as a promising technology that can address the limits of data transfer for future high-performance silicon chips. Recent pushes to enhance optical communication have focused on developing wavelength-division multiplexing technology, and new dimensions of data transfer will be paramount to fulfill the ever-growing need for speed. Here we demonstrate an integrated multi-dimensional communication scheme that combines wavelength- and mode- multiplexing on a silicon photonic circuit. Using foundry-compatible photonic inverse design and spectrally flattened microcombs, we demonstrate a 1.12-Tb/s natively error-free data transmission throughout a silicon nanophotonic waveguide. Furthermore, we implement inverse-designed surface-normal couplers to enable multimode optical transmission between separate silicon chips throughout a multimode-matched fibre. All the inverse-designed devices comply with the process design rules for standard silicon photonic foundries. Our approach is inherently scalable to a multiplicative enhancement over the state of the art silicon photonic transmitters.

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Source
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC9772188PMC
http://dx.doi.org/10.1038/s41467-022-35446-4DOI Listing

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