Copper nanoparticle (Cu NP) is a promising replacement for noble metal nanoparticles due to its high electrical conductivity and low cost. However, Cu NPs are relatively active compared to noble metals, and current ways of protecting Cu NPs from oxidation by encapsulation have severe drawbacks, such as a long reaction time and complicated processes. Here, a facial and effective method to prepare the mesosphere of carbon-shelled copper nanoparticles (Cu@MC) was demonstrated, and the resulting Cu@MC was both highly electrically conductive and thermally stable. Cu@organic (100 nm) was first synthesized by the reduction of Cu ions with poly (vinyl pyrrolidone) (PVP) and sodium poly ((naphthalene-formaldehyde) sulfonate) (Na-PNFS) as soft templates. Then, the carbon shells were obtained by in situ carbonization of the polymer soft templates. The Cu@organic and Cu@MC showed an anti-oxidation ability up to 175 and 250 °C in the air atmosphere, respectively. Furthermore, the Cu@MC exhibited excellent volume resistivity of 7.2 × 10 Ω·cm under 20 MPa, and showed promising application potential in electric sensors and devices.

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http://www.ncbi.nlm.nih.gov/pmc/articles/PMC9654284PMC
http://dx.doi.org/10.3390/ma15217536DOI Listing

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