Ceria-based abrasives are widely used in precision chemical mechanical polishing (CMP) fields, such as thin film transistor liquid crystal display (TFT-LCD) glass substrates and integrated circuits, because of their excellent physicochemical properties. Rare earth carbonates, as precursors of ceria-based abrasives, directly affect the morphology of ceria-based abrasives, which, in turn, affects the material removal rate (MRR) and the surface roughness (R) after polishing. Herein, rare earth carbonates with different morphologies were obtained by adjusting reaction parameters during precipitation, including flake, spindle, and spheroid. Moreover, the phase of precursors was analyzed, and the evolution process of morphology from precursors to ceria-based abrasives was investigated. Furthermore, the effect of precursors on the polishing performance of ceria-based abrasives was explored. The results show that the primary particles of ceria-based abrasives are near-spherical, but the morphology and dispersion of the secondary particles are obviously inherited from precursors. Among them, near-spherical ceria-based abrasives prepared by nearly monodisperse near-spherical precursors show better uniformity and higher dispersion, and they not only achieve the lowest R but also obtain a higher MRR of 555 nm/min (9 wt.%) for polishing TFT-LCD glass substrates. The result is significant for the further optimization and application of high-performance ceria-based abrasives.
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http://dx.doi.org/10.3390/ma15217525 | DOI Listing |
Materials (Basel)
October 2022
National Engineering Research Center for Rare Earth Materials, GRINM Group Co., Ltd., Beijing 100088, China.
Ceria-based abrasives are widely used in precision chemical mechanical polishing (CMP) fields, such as thin film transistor liquid crystal display (TFT-LCD) glass substrates and integrated circuits, because of their excellent physicochemical properties. Rare earth carbonates, as precursors of ceria-based abrasives, directly affect the morphology of ceria-based abrasives, which, in turn, affects the material removal rate (MRR) and the surface roughness (R) after polishing. Herein, rare earth carbonates with different morphologies were obtained by adjusting reaction parameters during precipitation, including flake, spindle, and spheroid.
View Article and Find Full Text PDFJ Colloid Interface Sci
July 2010
Department of Chemical & Biomolecular Engineering, Clarkson University, Potsdam, NY 13699, USA.
We show that by adding poly(acrylicacid-co-diallyldimethylammonium chloride), a cationic polymer with a weight average molecular weight of about 4200 g/mole, to ceria-based dispersions, it is possible to achieve a silicon nitride removal rate (RR) of >100 nm/min and a silicon dioxide RR of <2 nm/min at pH 4 and 4 psi down pressure during chemical mechanical polishing. Furthermore, the RRs of the silicon dioxide films can be tuned by varying the polymer to abrasive weight ratio in the dispersion while the nitride RR is unaffected. We also characterized the role of adsorption of this polymer additive on ceria, silica and silicon nitride powders using zeta potential, adsorption isotherms, UV-Vis spectroscopy, contact angle, thermo-gravimetric analysis and friction coefficient measurements.
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