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Flow Boiling Enhancement Using Three-Dimensional Contact-Line Pinning on Hierarchical Superbiphilic Micro/Nanostructures. | LitMetric

Flow Boiling Enhancement Using Three-Dimensional Contact-Line Pinning on Hierarchical Superbiphilic Micro/Nanostructures.

Nano Lett

Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR China.

Published: November 2022

Flow boiling is a promising method for the cooling of sensitive computational and industrial components, facilitating the transportation of large quantities of heat at near-constant temperature and in a small form factor. The prevention of vapor film formation is a fundamental challenge for the enhancement of boiling systems, and an impetus therefore exists for the discovery of new techniques to segregate nucleating bubbles during their formation. Herein, we utilize the strong capillary forces generated by nanostructures to pin the liquid/vapor interface in three dimensions and thereby control the coalescence and flow interactions of developing bubbles. We demonstrate this principle on both symmetrical and asymmetrical superbiphilic microstructures, showing enhancement of peak heat transfer coefficient by 81% and 113%, respectively, when compared to the best superhydrophilic and superhydrophobic analogues. Our approach shows a potential future direction for engineered boiling micro/nanostructures, wherein bubble dynamics are directly manipulated on bespoke, three-dimensional substrates.

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Source
http://dx.doi.org/10.1021/acs.nanolett.2c02915DOI Listing

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