3D in-plane integrated micro reflectors enhancing signal capture in lab on a chip applications.

The integration of micro-optics in lab on a chip (LOCs) devices is crucial both for increasing the solid angle of acquisition and reducing the optical losses, aiming at improving the signal-to-noise ratio (SNR). In this work, we present the thriving combination of femtosecond laser irradiation followed by chemical etching (FLICE) technique with CO laser polishing and inkjet printing to fabricate in-plane, 3D off-axis reflectors, featuring ultra-high optical quality (RMS ∼3 nm), fully integrated on fused silica substrates. Such micro-optic elements can be used both in the excitation path, focusing an incoming beam in 3D, and in the acquisition branch, harvesting the optical signal coming from a specific point in space. The flexibility of the manufacturing process allows the realization of micro-optics with several sizes, shapes and their integration with photonic circuits and microfluidic networks.