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A solution-processable and highly flexible conductor of a fluoroelastomer FKM and carbon nanotubes with tuned electrical conductivity and mechanical performance. | LitMetric

A solution-processable and highly flexible conductor of a fluoroelastomer FKM and carbon nanotubes with tuned electrical conductivity and mechanical performance.

Soft Matter

Center for Applied Polymer and Nanotechnology (CAPNA), Department of Chemical and Petroleum Engineering, University of Calgary, Calgary, AB, T2N 1N4, Canada.

Published: October 2022

The use of fluoroelastomer nanocomposites for flexible electronics is increasing due to their high deformability and recoverability. Often, a high amount of conductive nanofillers and crosslinking agents is required to improve their mechanical performance, which unfavorably affects the electrical percolation threshold and conductivity due to dispersion issues. Herein, we developed a unique solution mixing (SM) technique by a fine-tuned formulation to obtain well-dispersed carbon nanotubes (CNTs) in fluoroelastomer FKM for both low and high CNT concentrations (0.2 phr and 3 phr). Effective nano-network formation was confirmed by transmission electron microscopy (TEM) and oscillatory shear rheological tests. Compared to the melt mixing (MM) process, the stretchability of neat FKM improves to 503% in the SM process 430% in the MM process. The electrical conductivity of the SM samples percolates at significantly lower filler concentrations (, 0.35 phr in SM 0.45 phr in MM) with a maximum value of 7 × 10 S cm for 3 phr. Overall, the 2 phr CNT/FKM nanocomposite fabricated by SM exceeds those of carbon-based FKM conductors reported in the literature. The enhanced electrical and mechanical properties include an electrical conductivity of 3 × 10 S cm, a strain-to-failure of 300%, and a tensile strength at break of 12 MPa. This process is a promising approach for fabricating fluoroelastomer nanocomposites of a mechanically robust and stable stretchable conductor for various wearable electronic devices.

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Source
http://dx.doi.org/10.1039/d2sm00838fDOI Listing

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