Surface treatment after dry etching is vital to enhance the surface quality of the material and thus improve device performance. In this Letter, we identified the majority surface states induced by the dry etching of β-GaO and optimized surface treatments to suppress these electrically active defects with the improved performance of Schottky barrier diodes. Transient spectroscopies suggested that the majority traps (-0.75 eV) related to divacancies (V-V) were enhanced in the concentration of 3.37 × 10 cm by dry etching and reduced to 0.90 × 10 cm by the combined means of oxygen annealing and piranha solution treatment. The trap evolution is supported by the suppressed donor-acceptor pair radiative recombination related to oxygen vacancies, the improved carrier transport (negligible hysteresis current-voltage and unity ideality factor), and the reduced surface band bending. These findings provide a straightforward strategy to improve surface quality for the further performance improvement of GaO power diodes.
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http://dx.doi.org/10.1021/acs.jpclett.2c02167 | DOI Listing |
Light Sci Appl
January 2025
Institute for Photon Science and Technology, The University of Tokyo, Tokyo, Japan.
Light manipulation and control are essential in various contemporary technologies, and as these technologies evolve, the demand for miniaturized optical components increases. Planar-lens technologies, such as metasurfaces and diffractive optical elements, have gained attention in recent years for their potential to dramatically reduce the thickness of traditional refractive optical systems. However, their fabrication, particularly for visible wavelengths, involves complex and costly processes, such as high-resolution lithography and dry-etching, which has limited their availability.
View Article and Find Full Text PDFMaterials (Basel)
December 2024
Department of Computer Information Science, Korea University, Sejong 30019, Republic of Korea.
Inductively coupled plasma-reactive etching (ICP-RIE) of InGaZnO (IGZO) thin films was studied with variations in gas mixtures of hydrochloride (HCl) and argon (Ar). The dry etching characteristics of the IGZO films were investigated according to radiofrequency bias power, gas mixing ratio, and chamber pressure. The IGZO film showed an excellent etch rate of 83.
View Article and Find Full Text PDFRev Sci Instrum
December 2024
State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, 200083 Shanghai, China.
Infrared photoluminescence (PL) spectroscopy with micron-scale spatial resolution is essential for the optoelectronic characterization of narrow-gap microstructures and single defects, yet it poses significant challenges due to the exceedingly weak PL signal and strong background thermal emission. This work introduces an infrared micro-PL (μPL) mapping system that achieves a spatial resolution of ∼2 μm, leveraging the inherent advantages of the step-scan Fourier transform infrared spectrometer-based modulated PL technique in the mid- and far-infrared regions. The configuration of the experimental system is described, and a theoretical upper limit of spatial resolution is derived to be about 1.
View Article and Find Full Text PDFDiscov Nano
December 2024
Department of Photonics, National Yang Ming Chiao Tung University, Hsinchu, 30010, Taiwan, ROC.
This study fabricated 10 μm chip size μLEDs of blue-light GaN based epilayers structure with different mesa processes using dry etching and ion implantation technology. Two ion sources, As and Ar, were applied to implant into the LED structure to achieve material isolation and avoid defects on the mesa sidewall caused by the plasma process. Excellent turn-on behavior was obtained in both ion-implanted samples, which also exhibited lower leakage current compared to the sample fabricated by the dry etching process.
View Article and Find Full Text PDFNanotechnology
December 2024
Department of Physics (DTU Fysik), Technical University of Denmark, Fysikvej, Kgs. Lyngby, 2800, DENMARK.
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