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Development of a Hybrid Intelligent Process Model for Micro-Electro Discharge Machining Using the TTM-MDS and Gaussian Process Regression. | LitMetric

AI Article Synopsis

  • The paper presents a hybrid intelligent process model that combines the two-temperature model (TTM) and molecular dynamics simulation (MDS) for analyzing metal films during short-pulse laser melting.
  • It constructs a model for the single-spark micro-electrical discharge machining (micro-EDM) process to predict key metrics like removed depth (RD) and material removal rate (MRR) using the TTM-MDS framework.
  • A Gaussian process regression (GPR) model is introduced to analyze the relationship between process parameters and outputs, demonstrating accurate predictions for micro-EDM machining outcomes based on the numerical simulations.

Article Abstract

This paper proposed a hybrid intelligent process model, based on a hybrid model combining the two-temperature model (TTM) and molecular dynamics simulation (MDS) (TTM-MDS). Combined atomistic-continuum modeling of short-pulse laser melting and disintegration of metal films [Physical Review B, 68, (064114):1-22.], and Gaussian process regression (GPR), for micro-electrical discharge machining (micro-EDM) were also used. A model of single-spark micro-EDM process has been constructed based on TTM-MDS model to predict the removed depth (RD) and material removal rate (MRR). Then, a GPR model was proposed to establish the relationship between input process parameters (energy area density and pulse-on duration) and the process responses (RD and MRR) for micro-EDM machining. The GPR model was trained, tested, and tuned using the data generated from the numerical simulations. Through the GPR model, it was found that micro-EDM process responses can be accurately predicted for the chosen process conditions. Therefore, the hybrid intelligent model proposed in this paper can be used for a micro-EDM process to predict the performance.

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Source
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC9227863PMC
http://dx.doi.org/10.3390/mi13060845DOI Listing

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