Thermal insulation materials are highly desirable for several applications ranging from building envelopes to thermal energy storage systems. A new type of low-cost insulation material called hollow silica particles (HSPs) was recently reported. The present work presents an HSP-based stand-alone composite that has very low thermal conductivity and is highly stable to moisture.
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|---|---|
| http://www.ncbi.nlm.nih.gov/pmc/articles/PMC9121439 | PMC |
| http://dx.doi.org/10.1039/d2ra01561g | DOI Listing |
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