Direct observation of contact resistivity for monolayer TMD based junctions PL spectroscopy.

Nanoscale

Collaborative Innovation Center for Optoelectronic Science and Technology, International Collaborative Laboratory of 2D Materials for Optoelectronic Science and Technology of Ministry of Education and Guangdong Province, Shenzhen University, Shenzhen, 518060, China.

Published: June 2022

Monolayer transition metal dichalcogenides (mTMDs) possess a direct band gap and strong PL emission that is highly sensitive to doping level and interfaces, laying the foundation for investigating the contact between mTMD and metal PL spectroscopy. Currently, electrical methods have been utilized to measure the contact resistance (), but they are complicated, time-consuming, high-cost and suffer from inevitable chemical disorders and Fermi level pinning. In addition, previously reported contact resistances comprise both Schottky barrier and tunnel barrier components. Here, we report a simple, rapid and low-cost method to study the tunnel barrier dominated contact resistance of mTMD based junctions through PL spectroscopy. These junctions are free from chemical disorders and Fermi level pinning. Excluding the Schottky barrier component, solely tunnel barrier dominated contact resistances of 1 L MoSe/Au and 1 L MoSe/graphene junctions were estimated to be 147.8 Ω μm and 54.9 Ω μm, respectively. Density functional theory (DFT) simulations revealed that the larger of the former was possibly due to the existence of intrinsic effective potential difference () between mTMD and metal. Both junctions exhibit an increasing tendency of as temperature decreases, which is probably attributed to the thermal expansion coefficient (TEC) mismatch-triggered interlayer spacing () increase and temperature-induced doping. Remarkably, a significant change of was observed in 1 L MoSe/Au junctions, which is possibly ascribed to the changes of their orbital overlaps. Our results open new avenues for exploring fundamental metal-semiconductor contact principles and constructing high-performance devices.

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http://dx.doi.org/10.1039/d2nr01504hDOI Listing

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