Severity: Warning
Message: file_get_contents(https://...@pubfacts.com&api_key=b8daa3ad693db53b1410957c26c9a51b4908&a=1): Failed to open stream: HTTP request failed! HTTP/1.1 429 Too Many Requests
Filename: helpers/my_audit_helper.php
Line Number: 176
Backtrace:
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 176
Function: file_get_contents
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 250
Function: simplexml_load_file_from_url
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 3122
Function: getPubMedXML
File: /var/www/html/application/controllers/Detail.php
Line: 575
Function: pubMedSearch_Global
File: /var/www/html/application/controllers/Detail.php
Line: 489
Function: pubMedGetRelatedKeyword
File: /var/www/html/index.php
Line: 316
Function: require_once
The article concerns the issue of non-invasive moisture sensing in building materials. Two techniques that enable evaluating the value of the relative permittivity of the material, being the measure of porous material moisture, have been utilized for the research. The first is the microwave technique that utilizes the non-contact measurement of velocity of microwave radiation across the tested material and the second is the time domain reflectometry (TDR) technique based on the measurement of electromagnetic pulse propagation time along the waveguides, being the elements of sensor design. The tested building material involved samples of red ceramic brick that differed in moisture, ranging between 0% and 14% moisture by weight. The main goal of the research was to present the measuring potential of both techniques for moisture evaluation as well as emphasize the advantages and disadvantages of each method. Within the research, it was stated that both methods provide similar measuring potential, with a slight advantage in favor of a microwave non-contact sensor over surface TDR sensor designs.
Download full-text PDF |
Source |
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http://www.ncbi.nlm.nih.gov/pmc/articles/PMC9145367 | PMC |
http://dx.doi.org/10.3390/s22103622 | DOI Listing |
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