Severity: Warning
Message: file_get_contents(https://...@pubfacts.com&api_key=b8daa3ad693db53b1410957c26c9a51b4908&a=1): Failed to open stream: HTTP request failed! HTTP/1.1 429 Too Many Requests
Filename: helpers/my_audit_helper.php
Line Number: 176
Backtrace:
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 176
Function: file_get_contents
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 250
Function: simplexml_load_file_from_url
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 1034
Function: getPubMedXML
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 3152
Function: GetPubMedArticleOutput_2016
File: /var/www/html/application/controllers/Detail.php
Line: 575
Function: pubMedSearch_Global
File: /var/www/html/application/controllers/Detail.php
Line: 489
Function: pubMedGetRelatedKeyword
File: /var/www/html/index.php
Line: 316
Function: require_once
Copper selenide is widely considered to be a promising candidate for high-performance flexible thermoelectrics; however, most of the reported values of copper selenides are unsatisfactory at a relatively low temperature range. Herein, we utilized some wet chemical methods to synthesize a series of copper selenides. XRD, SEM and TEM characterizations revealed that CuSe, CuSe and Cu Se were prepared successfully and possessed different morphologies and sizes. Based on the analysis of their thermoelectric properties, Cu Se exhibited the highest Seebeck coefficient and lowest thermal conductivity among the three samples owing to its unique crystal structure. After being sintered at 400 °C under N atmosphere, the electrical conductivity of Cu Se enhanced considerable, resulting in a significant improvement of its values from 0.096 to 0.458 at 30 to 150 °C. This result is remarkable for copper selenide-based thermoelectric materials at a relatively low temperature range, indicating its brilliant potential in the field of flexible thermoelectric devices.
Download full-text PDF |
Source |
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http://www.ncbi.nlm.nih.gov/pmc/articles/PMC9037115 | PMC |
http://dx.doi.org/10.1039/d1ra04626h | DOI Listing |
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