Due to the exponential growth in offshore renewable energies and structures such as floating offshore wind turbines and wave power converters, the research and engineering in this field is experiencing exceptional development. This emergence of offshore renewable energy requires power cables which are usually made up of copper to transport this energy ashore. These power cables are critical structures that must withstand harsh environmental conditions, handling, and shipping, at high seas which can cause copper wires to deform well above the limit of proportionality and consequently break. Copper, being an excellent electric conductor, has, however, very weak mechanical properties. If plasticity propagates inside copper not only will the mechanical properties be affected, but the electrical properties are also disrupted. Constantly monitoring such large-scale structures can be carried out by providing continuous strain using fiber-optic sensors (FOSs). The embedding of optical fibers within the cables (not within the phase) is practiced. Nevertheless, these optical fibers are first introduced into a cylinder of larger diameter than the optical fiber before this same fiber is embedded within the insulator surrounding the phases. Therefore, this type of embedding can in no way give a precise idea of the true deformation of the copper wires inside the phase. In this article, a set of numerical simulations are carried-out on a single phase (we are not yet working on the whole cable) with the aim of conceptualizing the placement of FOSs that will monitor strain and temperature within the conductor. It is well known that copper wire must never exceed temperatures above 90 °C, as this will result in shutdown of the whole system and therefore result in heavy maintenance, which would be a real catastrophe, economically speaking. This research explores the option of embedding sensors in several areas of the phase and how this can enable obtaining strain values that are representative of what really is happening in the conductor. It is, therefore, the primary objective of the current preliminary model to try to prove that the principle of embedding sensors in between copper wires can be envisaged, in particular to obtain an accurate idea about strain tensor of helical ones (multi-parameter strain sensing). The challenge is to ensure that they are not plastically deformed and hence able to transport electricity without exceeding or even becoming closer to 90 °C (fear of shutdown). The research solely focuses on mechanical aspects of the sensors. There are certainly some others, pertaining to sensors physics, instrumentation, and engineering, that are of prime importance, too. The upstream strategy of this research is to come up with a general concept that can be refined later by including, step by step, all the aspects listed above.
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http://dx.doi.org/10.3390/s22072444 | DOI Listing |
Materials (Basel)
December 2024
Division of Agrotechnological Systems Engineering and Work Safety, Institute of Agricultural Engineering, Wrocław University of Environmental and Life Sciences, 25 Norwida St., 50-375 Wroclaw, Poland.
In the present study, our emphasis was directed towards the fabrication process of long multi-core superconducting wires, each spanning several hundred meters. These wires feature an in situ MgB core, an ex situ MgB barrier, and a copper shield. The cost-effectiveness of these constituent materials, coupled with a judicious arrangement of internal components, facilitates the utilization of an economical shielding material for the resulting wire.
View Article and Find Full Text PDFMaterials (Basel)
December 2024
Fraunhofer Institute for Machine Tools and Forming Technology IWU, Nöthnitzer Straße 44, 01187 Dresden, Germany.
Using a newly developed tool head with an additional rotational axis and a wire feed, wires can be directly processed in the fused filament fabrication (FFF) process. Thus, electrical structures such as conductive paths, coils, heating elements, or sensors can be integrated into polymer parts. However, the accuracy of the wire deposition in curved sections of the print track is insufficient.
View Article and Find Full Text PDFScience
January 2025
Department of Electrical Engineering, Stanford University, Stanford, CA, USA.
The electrical resistivity of conventional metals such as copper is known to increase in thin films as a result of electron-surface scattering, thus limiting the performance of metals in nanoscale electronics. Here, we find an unusual reduction of resistivity with decreasing film thickness in niobium phosphide (NbP) semimetal deposited at relatively low temperatures of 400°C. In films thinner than 5 nanometers, the room temperature resistivity (~34 microhm centimeters for 1.
View Article and Find Full Text PDFJ Chem Phys
December 2024
Key Laboratory of Quantum Materials and Devices of Ministry of Education, School of Physics, Southeast University, Nanjing 211189, People's Republic of China.
The "green" copper halides with one-dimensional polyhedron chains are very interesting novel semiconductors. These weakly interacting parallel quantum wires (1D polyhedron chains) play key roles in their photophysical properties. Unlike Cs3Cu2I5, which has been much investigated, its homologous compounds Cs3Cu2Cl5 and CsCu2Cl3 remain less studied and their properties are controversial.
View Article and Find Full Text PDFPhys Rev Lett
November 2024
Département de physique, Institut quantique and Regroupement Québécois sur les Matériaux de Pointe, Université de Sherbrooke, Sherbrooke, Québec J1K 2R1, Canada.
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