We investigated the effect of top contact interface and microstructural characteristics of the insulating layers on resistive switching behaviors by fabricating and characterizing the HfO/ZnO bilayer heterostructures. Different thickness of ZnO underlying layer and different deposition temperatures of the upper HfOlayer were designed to analyze the intrinsic contribution of the crystalline microstructure of the insulating bilayer. Pt and Ti top electrodes were used to demonstrate the extrinsic contribution of the interface configuration. It was observed that all devices show bipolar RS characteristics. Unlike the device composed of Pt/HfO/ZnO/Pt that exhibit an abrupt switching, a gradually continuous switching in the reset process was identified in the device composed of Ti/HfO/ZnO/Pt. Interfacial charge migration process/characteristic plays a key role in the RS process as well as its conduction mechanism. The RS performance of the former is significantly better than that of the latter, including much lower reset voltage, two orders of magnitude larger OFF/ON ratio and HRS resistance. In addition, as compared to the intrinsic contribution arising from the microstructure of the HfO/ZnO bilayer to the RS performances and current transport mechanism, the extrinsic effect contributed from the electrode characteristics (and its interface) is dominant.
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http://dx.doi.org/10.1088/1361-6528/ac5e70 | DOI Listing |
Nanoscale
February 2024
Department of Semiconductor Processing Equipment, Semiconductor Convergence Campus of Korea Polytechnic College, Anseong, Kyunggi-Do, 17550, Republic of Korea.
The effects of thermal annealing on analog resistive switching behavior in bilayer HfO/ZnO synaptic devices were investigated. The annealed active ZnO layer between the top Pd electrode and the HfO layer exhibited electroforming-free resistive switching. In particular, the switching uniformity, stability, and reliability of the synaptic devices were dramatically improved thermal annealing at 600 °C atomic force microscopy and X-ray diffraction analyses revealed that active ZnO films demonstrated increased grain size upon annealing from 400 °C to 700 °C, whereas the ZnO film thickness and the annealing of the HfO layer in bilayer HfO/ZnO synaptic devices did not profoundly affect the analog switching behavior.
View Article and Find Full Text PDFNanomaterials (Basel)
October 2023
Division of Electronics and Electrical Engineering, Dongguk University, Seoul 04620, Republic of Korea.
This study discusses the potential application of ITO/ZnO/HfO/W bilayer-structured memory devices in neuromorphic systems. These devices exhibit uniform resistive switching characteristics and demonstrate favorable endurance (>10) and stable retention (>10 s). Notably, the formation and rupture of filaments at the interface of ZnO and HfO contribute to a higher ON/OFF ratio and improve cycle uniformity compared to RRAM devices without the HfO layer.
View Article and Find Full Text PDFNanomaterials (Basel)
October 2022
Fujian Science & Technology Innovation Laboratory for Optoelectronic Information of China, Fuzhou 350108, China.
The multilevel properties of a memristor are significant for applications in non-volatile multi-state storage and electronic synapses. However, the reproducibility and stability of the intermediate resistance states are still challenging. A stacked HfOx/ZnO bilayer embedded with copper nanoparticles was thus proposed to investigate its multilevel properties and to emulate synaptic plasticity.
View Article and Find Full Text PDFNanotechnology
April 2022
College of Electronic and Optical Engineering, Nanjing University of Posts and Telecommunications, Nanjing 210023, People's Republic of China.
We investigated the effect of top contact interface and microstructural characteristics of the insulating layers on resistive switching behaviors by fabricating and characterizing the HfO/ZnO bilayer heterostructures. Different thickness of ZnO underlying layer and different deposition temperatures of the upper HfOlayer were designed to analyze the intrinsic contribution of the crystalline microstructure of the insulating bilayer. Pt and Ti top electrodes were used to demonstrate the extrinsic contribution of the interface configuration.
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