Durability of resin bonding to lithium disilicate using different self-etching and conventional ceramic primers after long-term aging.

Dent Mater

Department of Prosthodontics, Propaedeutics and Dental Materials, School of Dentistry, Christian-Albrechts University at Kiel, Arnold-Heller-Straße 16, 24105 Kiel, Germany. Electronic address:

Published: February 2022

Objectives: To evaluate the bonding durability after artificial aging provided by a self-etching and a no-etching ceramic primer compared to primers, which are applied by the etch and rinse method.

Methods: Lithium disilicate blocks were bonded to a composite resin (Clearfill Core, Kuraray) using 5 bonding methods (N = 24). Specimens of group MEP were bonded using a self-etching primer and the corresponding luting resin (Monobond Etch&Prime/Variolink Esthetic, Ivoclar Vivadent) Specimens of group UBE were bonded using a two-bottle silane solution (Universal Primer/Estecem, Tokuyama) without hydrofluoric acid ceramic etching. Specimens of the other 3 groups were bonded using etch and rinse bonding systems with prior hydrofluoric acid ceramic etching (MPV: Monobond Plus/Variolink Esthetic, Ivoclar Vivadent; SUR: Scotchbond Universal/RelyX Ultimate, 3 M; GML: G-Multi Primer/G-CEM LinkForce, GC). Each group was divided into 3 subgroups (n = 8) according to the storage conditions (3 days water storage (37 °C), 30 days water storage, 7,500 thermal cycles (5-55 °C) and 150 days water storage, 37,500 thermal cycles). The tensile bond strength (TBS) was measured and the data was statistically analyzed.

Results: After 3 days the median TBS ranged from 14.6 to 41.7 MPa, after 30 days from 4.2 to 39.0 MPa and after 150 days from 0 to 29.7 MPa. Both bonding systems utilizing a self-etching primer showed a significantly lower TBS than group MPV using a conventional ceramic bonding system.

Significance: Especially after long-term storage with additional thermal cycling the bonding systems using primers without hydrofluoric acid ceramic etching do not provide a high bond strength.

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Source
http://dx.doi.org/10.1016/j.dental.2021.12.027DOI Listing

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