AI Article Synopsis

  • Hafnia-based ferroelectric memory devices are gaining attention for their low power and fast performance, but traditional high-temperature processing (>500 °C) limits their use on flexible substrates.
  • Researchers proposed a novel low-temperature crystallization method (∼250 °C) using focused microwave annealing to overcome this limitation, allowing HfZrO (HZO) thin films to be used on flexible mica substrates.
  • The resulting HZO thin films showed strong electrical properties and were successfully integrated into flexible transistor devices, achieving impressive performance with high recognition accuracy for synaptic applications.

Article Abstract

Hafnia-based ferroelectric memory devices with excellent ferroelectricity, low power consumption, and fast operation speed have attracted considerable interest with the ever-growing desire for nonvolatile memory in flexible electronics. However, hafnia films are required to perform a high temperature (>500 °C) annealing process for crystallization into the ferroelectric orthorhombic phase. It can hinder the integration of hafnia ferroelectric films on flexible substrates including plastic and polymer, which are not endurable at high temperatures above 300 °C. Here, we propose the extremely low-temperature (∼250 °C) process for crystallization of HfZrO (HZO) thin films by applying a focused-microwave induced annealing method. HZO thin films on a flexible mica substrate exhibits robust remnant polarization (2P ∼ 50 μC/cm), which is negligibly changed under bending tests. In addition, the electrical characteristics of a HZO capacitor on the mica substrate were evaluated, and ferroelectric thin film transistors (Fe-TFTs), using a HZO gate insulator, were fabricated on mica substrates for flexible synapse applications. Symmetric potentiation and depression characteristics are successfully demonstrated in the Fe-TFT memory devices, and the synaptic devices result in high recognition accuracy of 91.44%. The low-temperature annealing method used in this work are promising for forming hafnia-based Fe-TFT memory devices as a building block on a flexible platform.

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Source
http://dx.doi.org/10.1021/acsami.1c16873DOI Listing

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