We performed a systematic study involving simulation and experimental techniques to develop induced-junction silicon photodetectors passivated with thermally grown SiO and plasma-enhanced chemical vapor deposited (PECVD) SiN thin films that show a record high quantum efficiency. We investigated PECVD SiN passivation and optimized the film deposition conditions to minimize the recombination losses at the silicon-dielectric interface as well as optical losses. Depositions with varied process parameters were carried out on test samples, followed by measurements of minority carrier lifetime, fixed charge density, and optical absorbance and reflectance. Subsequently, the surface recombination velocity, which is the limiting factor for internal quantum deficiency (IQD), was obtained for different film depositions via 2D simulations where the measured effective lifetime, fixed charge density, and substrate parameters were used as input. The quantum deficiency of induced-junction photodiodes that would be fabricated with a surface passivation of given characteristics was then estimated using improved 3D simulation models. A batch of induced-junction photodiodes was fabricated based on the passivation optimizations performed on test samples and predictions of simulations. Photodiodes passivated with PECVD SiN film as well as with a stack of thermally grown SiO and PECVD SiN films were fabricated. The photodiodes were assembled as light-trap detector with 7-reflections and their efficiency was tested with respect to a reference Predictable Quantum Efficient Detector (PQED) of known external quantum deficiency. The preliminary measurement results show that PQEDs based on our improved photodiodes passivated with stack of SiO/SiN have negligible quantum deficiencies with IQDs down to 1 ppm within 30 ppm measurement uncertainty.
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http://dx.doi.org/10.3390/s21237807 | DOI Listing |
ACS Appl Energy Mater
November 2024
Department of Materials, University of Oxford, Oxford OX1 3PH, U.K.
A highly efficient hole-selective passivating contact remains the crucial step required to increase the efficiency of polysilicon-based Si solar cells. The future development of solar modules depends on a device structure that can complement the electron-selective tunnel oxide passivating contact with an equivalent hole-selective contact. We investigate plasma enhanced chemical vapor deposited (PECVD) SiN and atomic layer deposited AlO as alternative nanolayers for the passivation layer in polysilicon tunnel contacts.
View Article and Find Full Text PDFSci Rep
September 2024
Department of Mathematics and Physics, Luoyang Institute of Science and Technology, Luoyang, 471023, People's Republic of China.
Co-doping of phosphorus and boron elements into crystalline silicon quantum dot (c-Si QD) is an effective approach for enhancing the photoluminescence (PL) performance. In this paper, we report on the preparation of hydrogenated silicon nitride (SiN:H) thin films embedded with phosphorus-boron co-doped c-Si QDs via plasma enhanced chemical vapor deposition route. Mixed dilution including hydrogen (H) and argon (Ar) is applied in the in-situ deposition process for optimizing the deposition process.
View Article and Find Full Text PDFMaterials (Basel)
February 2024
Institute of Technology for Carbon Neutralition, Yangzhou University, Yangzhou 225009, China.
Selective emitter (SE) technology significantly influences the passivation and contact properties of n-TOPCon solar cells. In this study, three mask layers (SiO, SiN, and SiON) were employed to fabricate n-TOPCon solar cells with phosphorus (P)-SE structures on the rear side using a three-step method. Additionally, phosphosilicon glass (PSG) was used to prepare n-TOPCon solar cells with P-SE structure on the rear side using four-step method, and the comparative analysis of electrical properties were studied.
View Article and Find Full Text PDFNanomaterials (Basel)
December 2022
Division of Electronics Engineering, Chung-nam National University, Daejeon 34134, Republic of Korea.
In this study, a silicon carbon nitride (SiCN) thin film was grown with a thickness of 5~70 nm by the plasma-enhanced chemical vapor deposition (PECVD) method, and the oxygen permeation characteristics were analyzed according to the partial pressure ratio (PPR) of tetramethylsilane (4MS) to the total gas amount during the film deposition. X-ray photoelectron spectroscopy (XPS), Fourier transform infrared spectroscopy (FT-IR), and X-ray reflectivity (XRR) were used to investigate the composition and bonding structures of the SiCN film. An atomic force microscope (AFM) was used to examine the surface morphology of the SiCN films to see the porosity.
View Article and Find Full Text PDFACS Appl Mater Interfaces
June 2022
Department of Electrical and Computer Engineering, Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States.
Aluminum nitride (AlN) continues to kindle considerable interest in various microelectromechanical system (MEMS)-related fields because of its superior optical, mechanical, thermal, and piezoelectric properties. In this study, we use magnetron sputtering to tailor intrinsic stress in AlN thin films from highly compressive (-1200 MPa) to highly tensile (+700 MPa), with a differential stress of 1900 MPa. By monolithically combining the compressive and tensile ultrathin AlN bilayer membranes (20-60 nm) during deposition, perfectly curved three-dimensional (3D) architectures are spontaneously formed upon dry-releasing from the substrate via a 3D MEMS approach: the complementary metal-oxide-semiconductor (CMOS)-compatible strain-induced self-rolled-up membrane (S-RuM) method.
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