FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers.

The present study is a focused and comprehensive analysis of the dielectric and thermal properties of twenty-four 3D printed polymers suitable for fused filament fabrication (FFF) in electronic applications. The selected polymers include various thermoplastic elastomers, such as thermoplastics based on polycarbonate (PC), polyethylene terephthalate glycol (PETG), and acrylonitrile butadiene styrene (ABS-T). Their overall thermal behavior, including oxidation stability, glass transition, and melting temperature, was explored using simultaneous thermal analysis (STA) and differential scanning calorimetry (DSC). Considering their intended usage in electronic applications, the dielectric strength () and surface/volume resistivity (/) were comprehensively tested according to IEC 60243-1 and IEC 62631-3, respectively. The values of the dielectric constant (') and loss factor (") were also determined by broadband dielectric spectroscopy (BDS). While, on the one hand, exceptional dielectric properties were observed for some thermoplastic elastomers, the materials based on PCs, on the other hand, stood out from the others due to their high oxidation stability and above average dielectric properties. The low-cost materials based on PETG or ABS-T did not achieve thermal properties similar to those of the other tested polymers; nevertheless, considering the very reasonable price of these polymers, the obtained dielectric properties are promising for undemanding electronic applications.