Silicon (Si) anode materials have attracted substantial interest due to their high theoretical capacity. Here, the growth of helical Si@CuSi nanorod arrays glancing angle deposition (GLAD) followed by an annealing process is reported. Pre-deposited Cu atoms were driven into Si-nanorods and successfully reacted with Si to form a Si-Cu alloy at a high temperature. By varying the rotation rate and annealing temperature, the resultant Si@CuSi nanorod arrays showed a reasonably accessible surface area with precise control spacing behavior in favor of accommodating Si volume expansion. Meanwhile, the Si@CuSi anode materials showed higher electrical conductivity, facilitating Li ion diffusion and electron transfer. The Si@CuSi nanorod arrays in half cells exhibited a volumetric capacity as high as 3350.1 mA h cm at a rate of 0.25 C and could maintain 1706.7 mA h cm after 100 cycles, which are superior to those of pristine Si materials. This facile and innovative technology provided new insights into the development of Si-based electrode materials.
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http://dx.doi.org/10.1039/d1nr05297g | DOI Listing |
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