Silicon (Si) anode materials have attracted substantial interest due to their high theoretical capacity. Here, the growth of helical Si@CuSi nanorod arrays glancing angle deposition (GLAD) followed by an annealing process is reported. Pre-deposited Cu atoms were driven into Si-nanorods and successfully reacted with Si to form a Si-Cu alloy at a high temperature. By varying the rotation rate and annealing temperature, the resultant Si@CuSi nanorod arrays showed a reasonably accessible surface area with precise control spacing behavior in favor of accommodating Si volume expansion. Meanwhile, the Si@CuSi anode materials showed higher electrical conductivity, facilitating Li ion diffusion and electron transfer. The Si@CuSi nanorod arrays in half cells exhibited a volumetric capacity as high as 3350.1 mA h cm at a rate of 0.25 C and could maintain 1706.7 mA h cm after 100 cycles, which are superior to those of pristine Si materials. This facile and innovative technology provided new insights into the development of Si-based electrode materials.

Download full-text PDF

Source
http://dx.doi.org/10.1039/d1nr05297gDOI Listing

Publication Analysis

Top Keywords

si@cusi nanorod
16
nanorod arrays
16
glancing angle
8
angle deposition
8
helical si@cusi
8
anode materials
8
si@cusi
5
deposition large-scale
4
large-scale helical
4
nanorod
4

Similar Publications

Want AI Summaries of new PubMed Abstracts delivered to your In-box?

Enter search terms and have AI summaries delivered each week - change queries or unsubscribe any time!