AI Article Synopsis

  • Microbial inoculants, especially arbuscular mycorrhizal (AM) fungi, can enhance sustainable crop management by improving plant growth and nutrient uptake.
  • The study focused on optimizing conditions for AM fungal spore production, determining that a phosphorus (P) level of 20 µM in the growth medium led to the highest spore yield in vitro.
  • In vivo experiments revealed that certain substrate particle sizes and the strategic management of P levels significantly impacted both spore production and fungal colonization in maize plants.

Article Abstract

Microbial inoculants, particularly arbuscular mycorrhizal (AM) fungi, have great potential for sustainable crop management. In this study, monoxenic culture of indigenous was developed and used as a tool to determine the minimum phosphorus (P) level for maximum spore production under the in vitro conditions. This type of starter AM fungal inoculum was then applied to an in vivo substrate-based mass-cultivation system. Spore production, colonization rate, and plant growth were examined in maize ( L.) plant inoculated with the monoxenic culture of in sand graded by particle size with varying P levels in nutrient treatments. In the in vitro culture, the growth medium supplemented with 20 µM P generated the maximum number of spores (400 spores/mL media) of . In the in vivo system, the highest sporulation (≈500 spores g sand) occurred when we added a half-strength Hoagland solution (20 µM P) in the sand with particle size between 500 µm and 710 µm and omitted P after seven weeks. However, the highest colonization occurred when we added a half-strength Hoagland solution in the sand with particle sizes between 710 µm and 1000 µm and omitted P after seven weeks. This study suggests that substrate particle size and P reduction and regulation might have a strong influence on the maximization of sporulation and colonization of in sand substrate-based culture.

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Source
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC8541049PMC
http://dx.doi.org/10.3390/jof7100846DOI Listing

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