AI Article Synopsis
- Researchers developed new sandwich composites made of aluminum nitride (AlN) and epoxy, which improved thermal conductivity and dielectric strength.
- The optimized composite (with a specific thickness of 120 μm outer layer and 60 μm inner layer) showed a thermal conductivity of 0.754 W/(m·K) and a dielectric breakdown strength of 69.7 kV/mm, outperforming regular epoxy.
- These composites' enhanced thermal and electrical properties make them suitable for use in power electronics and power equipment applications.
Article Abstract
Polymer-based composites with high thermal conductivity and dielectric breakdown strength have gained increasing attention due to their significant application potential in both power electronic devices and power equipment. In this study, we successfully prepared novel sandwich AlN/epoxy composites with various layer thicknesses, showing simultaneously and remarkably enhanced dielectric breakdown strength and thermal conductivity. The most optimized sandwich composite, with an outer layer thickness of 120 μm and an inner layer thickness of 60 μm (abbreviated as 120-60) exhibits a high through-plane thermal conductivity of 0.754 W/(m·K) (4.1 times of epoxy) and has a dielectric breakdown strength of 69.7 kV/mm, 8.1% higher compared to that of epoxy. The sandwich composites also have higher in-plane thermal conductivity (1.88 W/(m·K) for 120-60) based on the novel parallel models. The sandwich composites with desirable thermal and electrical properties are very promising for application in power electronic devices and power equipment.
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|---|---|
| http://www.ncbi.nlm.nih.gov/pmc/articles/PMC8401393 | PMC |
| http://dx.doi.org/10.3390/nano11081898 | DOI Listing |
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