AI Article Synopsis
- A new ligand called tBu-PONNOP, featuring two di-tert-butylphosphinito groups on a naphthyridine structure, has been created and studied for its ability to bond with coinage metals like gold, silver, and copper.
- The research revealed that these metals interact differently with the ligand, with the order of strength being gold < silver < copper.
- Complexes of silver with the ligand were formed, which could potentially be used to produce tBu-PONNOP through a process called transmetallation.
Article Abstract
An expanded pincer ligand tBu-PONNOP (2,7-bis(di-tert-butylphosphinito)-1,8-naphthyridine) has been synthesised and its coordination to coinage metals has been studied. Bimetallic complexes were produced with metal halide salts of the type [MX(tBu-PONNOP)] (X = Cl, M = Au, Ag, Cu; X = I, M = Cu) with a varying degree of interaction with the naphthyridyl backbone in the order Au < Ag < Cu. The salts [Ag(tBu-PONNOP)][BAr] (Ar = 3,5-CH(CF)) and [Ag(NCMe)(tBu-PONNOP)]X (X = BAr, PF) were prepared, which may serve as a source of tBu-PONNOP via transmetallation.
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| http://dx.doi.org/10.1039/d1dt01741a | DOI Listing |
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