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Release of Neutrals in Electron-Induced Ligand Separation from MeCpPtMe: Theory Meets Experiment.
J Phys Chem A
February 2025
MBN Research Center, Altenhöferallee 3, Frankfurt am Main 60438, Germany.
The interest in the electron impact-induced ligand release from MeCpPtMe [trimethyl(methylcyclopentadienyl)platinum(IV)] is motivated by its widespread use as a precursor in focused electron and ion beam nanofabrication. By experimentally studying the electron impact dissociative ionization of MeCpPtMe under single-collision conditions, we have found that the removal of two methyl radicals is energetically more favorable than the removal of one radical and even energetically comparable to the nondissociative ionization of MeCpPtMe. This observation is explained by the structural rearrangement of the MeCpPtMe ion prior to dissociation, resulting in the removal of ethane instead of two methyl groups.
View Article and Find Full Text PDFFabrication of broadband-emissive micro/nanostructures using two-photon lithography.
Nanotechnology
December 2024
Nanostructures Engineering and Modeling Laboratory, Department of Metallurgical Engineering and Materials Science, Indian Institute of Technology Bombay, Mumbai 400076, MH, India.
Article Synopsis
- - The development of broadband emissive micro/nanoscale structures allows for innovative multifunctional devices applicable in fields like lighting, sensing, and biomedical technologies, but traditional fabrication methods are often complex and costly.
- - Conventional techniques struggle with precision and efficiency, particularly in achieving high-resolution 3D features, highlighting the need for better methods.
- - This research introduces a single-step fabrication technique using two-photon lithography to create versatile micro/nanostructures with improved broadband emissive properties, paving the way for advances in photonics and related fields.
Surface plasmon lithography (SPL) has emerged as an innovative approach to nano-fabrication, offering an alternative to traditional patterning methods. To enhance its pattern fidelity in manufacturing, it is essential to incorporate mask correction to reduce critical dimension (CD) errors between the intended target features and the photoresist image. Traditionally, the aerial image of SPL has been modeled and simulated using methods such as finite difference time domain (FDTD) or rigorous coupled wave analysis (RCWA).
View Article and Find Full Text PDFSilicon microfabrication technologies for biology integrated advance devices and interfaces.
Biosens Bioelectron
October 2023
Tyndall National Institute, University College Cork, T12R5CP, Ireland.
Miniaturization is the trend to manufacture ever smaller devices and this process requires knowledge, experience, understanding of materials, manufacturing techniques and scaling laws. The fabrication techniques used in semiconductor industry deliver an exceptionally high yield of devices and provide a well-established platform. Today, these miniaturized devices are manufactured with high reproducibility, design flexibility, scalability and multiplexed features to be used in several applications including micro-, nano-fluidics, implantable chips, diagnostics/biosensors and neural probes.
View Article and Find Full Text PDFNanofabrication meets open science.
Nat Nanotechnol
August 2021
Institute of Physics, Swiss Federal Institute of Technology Lausanne (EPFL), Lausanne, Switzerland.
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