Grain-boundary-rich polycrystalline monolayer WS film for attomolar-level Hg sensors.

Nat Commun

Center for High Pressure Science, State Key Lab of Metastable Materials Science and Technology, Yanshan University, Qinhuangdao, People's Republic of China.

Published: June 2021

AI Article Synopsis

  • Emerging 2D layered materials are gaining popularity for creating advanced biological and chemical sensors due to their unique properties.
  • The effectiveness of these sensors heavily relies on structural defects in the materials, which are necessary for attracting analytes, but controlling these defects remains difficult.
  • This study introduces high-density grain boundary (GB) films of 2D materials, specifically demonstrating their superior sensitivity and selectivity in detecting mercury, highlighting their potential for next-generation ultra-sensitive sensors.

Article Abstract

Emerging two-dimensional (2D) layered materials have been attracting great attention as sensing materials for next-generation high-performance biological and chemical sensors. The sensor performance of 2D materials is strongly dependent on the structural defects as indispensable active sites for analyte adsorption. However, controllable defect engineering in 2D materials is still challenging. In the present work, we propose exploitation of controllably grown polycrystalline films of 2D layered materials with high-density grain boundaries (GBs) for design of ultra-sensitive ion sensors, where abundant structural defects on GBs act as favorable active sites for ion adsorption. As a proof-of-concept, our fabricated surface plasmon resonance sensors with GB-rich polycrystalline monolayer WS films have exhibited high selectivity and superior attomolar-level sensitivity in Hg detection owing to high-density GBs. This work provides a promising avenue for design of ultra-sensitive sensors based on GB-rich 2D layered materials.

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Source
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC8222231PMC
http://dx.doi.org/10.1038/s41467-021-24254-xDOI Listing

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