A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature.

A novel bonding process using Ag agglomerates paste prepared by AgO reduction has been proposed, which solved the problem of Cu substrate oxidation in the conventional AgO sintering process for Cu-Cu bonding. By applying the Ag agglomerate paste to Ag-Ag bonding, a shear strength of 28.3 MPa at 150 °C was obtained. Further studies showed that the optimum sintering temperature was at 225 °C, and a shear strength of 46.4 MPa was obtained. In addition, a shear strength of 20 MPa was obtained at 225 °C for Cu-Cu bonding. Compared to common Ag pastes, the results in this paper revealed that the sintering behavior of Ag agglomerates was unique, and the sintering mechanisms for Ag-Ag and Cu-Cu bonding were also discussed.