4D printing is an emerging fabrication technology that enables 3D printed structures to change configuration over "time" in response to an environmental stimulus. Compared with other soft active materials used for 4D printing, shape-memory polymers (SMPs) have higher stiffness, and are compatible with various 3D printing technologies. Among them, ultraviolet (UV)-curable SMPs are compatible with Digital Light Processing (DLP)-based 3D printing to fabricate SMP-based structures with complex geometry and high-resolution. However, UV-curable SMPs have limitations in terms of mechanical performance, which significantly constrains their application ranges. Here, a mechanically robust and UV-curable SMP system is reported, which is highly deformable, fatigue resistant, and compatible with DLP-based 3D printing, to fabricate high-resolution (up to 2 µm), highly complex 3D structures that exhibit large shape change (up to 1240%) upon heating. More importantly, the developed SMP system exhibits excellent fatigue resistance and can be repeatedly loaded more than 10 000 times. The development of the mechanically robust and UV-curable SMPs significantly improves the mechanical performance of the SMP-based 4D printing structures, which allows them to be applied to engineering applications such as aerospace, smart furniture, and soft robots.
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http://dx.doi.org/10.1002/adma.202101298 | DOI Listing |
BMC Infect Dis
January 2025
Department of Clinical Laboratory, Key Laboratory of Clinical Laboratory Medicine of Guangxi Department of Education, the First Affiliated Hospital of Guangxi Medical University, Nanning, China.
Background: In clinical practice, the emergence of ST11-K64 carbapenem-resistant Klebsiella pneumoniae (ST11-K64 CRKP) has become increasingly alarming. Despite this trend, limited research has been conducted to elucidate the clinical and molecular characteristics of these strains.
Objectives: This study aimed to comprehensively investigate the clinical characteristics, antimicrobial resistance patterns, resistance and virulence-associated genes, and molecular epidemiology of ST11-K64 CRKP in Southwest China.
J Colloid Interface Sci
December 2024
College of Marine Life Sciences, Ocean University of China, No. 5 Yushan Road, Qingdao 266003, China. Electronic address:
Emergency bleeding presents significant challenges such as high blood flow and rapid hemorrhaging. However, many existing hemostatic bandages face limitations, including the uncontrolled release of hemostatic agents, insufficient mechanical strength, poor adhesion, and complex manufacturing processes. To address these limitations, we developed a multifunctional hydrogel bandage for emergency hemostasis using a one-pot synthesis method.
View Article and Find Full Text PDFJ Phys Condens Matter
January 2025
University of Science and Technology Beijing, No. 30, Xueyuan Road, Haidian District, Beijing, 100083, CHINA.
Boron nitride (BN), renowned for its exceptional optoelectrical properties, mechanical robustness, and thermal stability, has emerged as a promising two-dimensional (2D) material. Reinforcing AZ80 magnesium alloy with BN can significantly enhance its mechanical properties. To investigate and predict this enhancement during hot deformation, we introduce two independent modeling approaches a modified Johnson-Cook (J-C) constitutive model and an Artificial Neural Network (ANN).
View Article and Find Full Text PDFWaste Manag
January 2025
Helmholtz-Zentrum Dresden-Rossendorf, Helmholtz-Institute Freiberg for Resource-Technology, Freiberg, Germany.
Printed circuit boards represent an extraordinarily challenging fraction for the recycling of waste electric and electronic equipment. Due to the closely interlinked structure of the composing materials, the selective recycling of copper and closely associated precious metals from this composite material is compromised by losses during mechanical pre-processing. This problem could partially be overcome by a better understanding of the influence of particle size and shape on the recovery of finely comminuted and well-liberated metal particles during mechanical separation.
View Article and Find Full Text PDFPhys Rev Lett
December 2024
Key Laboratory of Materials Physics of Ministry of Education, School of Physics, Zhengzhou University, Zhengzhou 450001, China.
Manipulating elastic waves in lower-dimensional mechanical metamaterials has attracted much attention since it lays the foundation for the design of various elastic functional devices, especially for on-chip size. However, due to the experimental challenges, it is very difficult to control elastic waves in higher dimensions. In this Letter, we introduce an extra structural parameter to synthesize and investigate the on-chip Weyl physics in silicon-on-insulator system.
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