Synergy between the crack pattern and substrate elasticity in colloidal deposits.

Phys Rev E

Soft Materials Laboratory, Department of Physics, IIT Madras, Chennai-600036, India.

Published: March 2021

Desiccation cracks in colloidal deposits occur to release the excess strain energy arising from the competition between the drying induced shrinkage of the deposit and its adhesion to the substrate. Here we report remarkably different morphology of desiccation cracks in the dried patterns formed by the evaporation of sessile drops containing colloids on elastomer (soft) or glass (stiff) substrates. The change in the crack pattern, i.e., from radial cracks on stiff substrates to circular cracks on soft substrates, is shown to arise solely due to the variation in elasticity of the underlying substrates. Our experiments and calculations reveal an intricate correlation between the desiccation crack patterns and the substrate's elasticity. The mismatch in modulus of elasticity between the substrate and that of the particulate deposit significantly alters the energy release rate during the nucleation and propagation of cracks. The stark variation in crack morphology is attributed to the tensile or compressive nature of the drying-induced in-plane stresses.

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Source
http://dx.doi.org/10.1103/PhysRevE.103.032602DOI Listing

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