Laponite-Mediated Copper Metallization by Palladium Intercalation.

An alternative catalytic method was employed using the reduction of Pd ions on the surface of cetyltrimethylammonium bromide (CTAB) treated laponite to initiate the electroless plating of copper; the deposition features of the Pd nanoparticles produced were investigated in detail. Results indicated intercalation and reduction of Pd nanoparticles occurred at room temperature and involved interaction between the laponite and the cetyltrimethylammonium cationic templates. Organic species and amount on laponite were optimized to adjust silicate platelet interlayer distances and platelet organophilic properties. Intercalation of Pd nanoparticles occurred between the magnesium silicate layers of laponite and this was dependent on pre-treatment and impregnation times. As impregnation is a method of producing heterogeneous catalysts, we considered Pd nanoparticles on laponite templates could catalyze the electroless deposition of Cu to initiate metallization. Cu films fabricated on laponite templates exhibited excellent surface roughness (˜1.7 nm) and low resistivity (˜3.42 Ω). The devised approach enabled the facile formation of a network suitable for Cu metallization without causing substrate damage and produced metal surfaces with excellent flatness and resistivity.