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Epoxidised sesame oil as a biobased coupling agent and plasticiser in polylactic acid/thermoplastic yam starch blends. | LitMetric

Epoxidised sesame oil as a biobased coupling agent and plasticiser in polylactic acid/thermoplastic yam starch blends.

Heliyon

Faculty of Chemical Sciences, Universidad Autónoma de Coahuila. V. Carranza s/n, 25000, Saltillo, Coahuila, Mexico.

Published: February 2021

AI Article Synopsis

  • The study focuses on enhancing the properties of polylactic acid (PLA) and thermoplastic yam starch (TPS) blends by using epoxidised sesame oil (ESO) derived from Colombian crops.
  • Various testing methods, including microscopy and thermal analysis, showed that adding ESO improved interfacial adhesion between the polymers and increased film smoothness and thermal stability.
  • The enhanced PLA and TPS blends with ESO show potential for use in semi-rigid food packaging due to their improved physicochemical properties.

Article Abstract

This work aims to improve the physicochemical properties of polylactic acid (PLA) and thermoplastic yam starch (TPS) blends using epoxidised sesame oil (ESO). We used epoxidised sesame oil from two Colombian Caribbean crops: and , with an oil substitution of 58.4 %. Films were obtained through extrusion and compression moulding processes. Moisture content, solubility, contact angle, and mechanical, barrier, and structural properties were determined using optical and scanning electron microscopy, infrared Fourier transform spectroscopy. Thermal analyses were also performed using thermogravimetry and differential scanning calorimetry techniques. The results suggest that the PLA and TPS interactions can be improved with the addition of ESO as coupling agent, enhancing the interfacial adhesion between the polymers, and favouring the smoothness of the film surface. Furthermore, the ESO addition led to increased thermal stability while restricting molecular mobility, indicating a coupling agent effect. In conclusion, the use of epoxidised oil for preparing films based on high PLA content and TPS allows obtaining enhanced interfacial adhesion. Considering the above, the developed materials have potential application in semi-rigid food packaging.

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Source
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC7887399PMC
http://dx.doi.org/10.1016/j.heliyon.2021.e06176DOI Listing

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