We present a proof-of-concept method to classify the presence of glass and metal in consumer trash bags. With the prevalent utilization of waste collection trucks in municipal solid waste management, the aim of this method is to help pinpoint the locations where waste sorting quality is below accepted standards, making it possible and more efficient to develop tailored procedures that can improve the waste sorting quality in areas with the most urgent needs. Using trash bags containing various amounts of glass and metal, in addition to common waste found in households, we use a combination of sound recording and a beat-frequency oscillation metal detector as inputs to a machine learning algorithm to identify the occurrence of glass and metal in trash bags. A custom-built test rig was developed to mimic a real waste collection truck, which was used to test different sensors and build the datasets. Convolutional neural networks were trained for the classification task, achieving accuracies of up to 98%. These promising results support this method's potential implementation in real waste collection trucks, enabling location-specific and long-term monitoring of consumer waste sorting quality, which can provide decision support for waste management systems, and research on consumer behavior.
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http://dx.doi.org/10.1016/j.wasman.2020.09.032 | DOI Listing |
Sci Rep
January 2025
Advanced Glass and Glass Ceramic Research Laboratory, Department of Physics, University of Lucknow, Lucknow, 226007, India.
Recently, 3-D porous architecture of the composites play a key role in cell proliferation, bone regeneration, and anticancer activities. The osteoinductive and osteoconductive properties of β-TCP allow for the complete repair of numerous bone defects. Herein, β-TCP was synthesized by wet chemical precipitation route, and their 3-D porous composites with HBO and Cu nanoparticles were prepared by the solid-state reaction method with improved mechanical and biological performances.
View Article and Find Full Text PDFAnal Chim Acta
February 2025
Institute for Advanced Study (IAS), College of Life Sciences and Oceanography, Shenzhen University, Shenzhen, Guangdong, 518060, China. Electronic address:
Background: Alzheimer's disease (AD) is a neurodegenerative disorder with a very long duration, posing a serious threat to people's life and health. To date, no medicine that can cure or reverse the disease has been developed or reported, so early diagnosis and timely intervention are essential. The concentration of Phosphorylated tau181 (P-tau181) in blood has been approved by FDA as a standard for assisting clinical diagnosis of AD.
View Article and Find Full Text PDFMaterials (Basel)
January 2025
Research Center of Digital Oral Science and Technology, College of Oral Medicine, Taipei Medical University, Taipei 110-301, Taiwan.
Bulk metallic glasses (i.e., BMGs) have attracted a lot of research and development interest due to their unique properties.
View Article and Find Full Text PDFMicromachines (Basel)
December 2024
Institute of Nanostructure Technologies and Analytics (INA), Technological Electronics Department and Center for Interdisciplinary Nanostructure Science and Technology (CINSaT), University of Kassel, Heinrich-Plett-Straße 40, 34132 Kassel, Germany.
Millions of electrostatically actuatable micromirror arrays have been arranged in between windowpanes in inert gas environments, enabling active daylighting in buildings for illumination and climatization. MEMS smart windows can reduce energy consumption significantly. However, to allow personalized light steering for arbitrary user positions with high flexibility, two main limitations must be overcome: first, limited tuning angle spans by MEMS pull-in effects; and second, the lack of a second orthogonal tuning angle, which is highly required.
View Article and Find Full Text PDFMicromachines (Basel)
December 2024
Zhejiang Xinsheng Semiconductor Technology, Zhuji 311899, China.
Silicon-glass anode bonding is the key technology in the process of wafer-level packaging for MEMS sensors. During the anodic bonding process, the device may experience adhesion failure due to the influence of electric field forces. A common solution is to add a metal shielding layer between the glass substrate and the device.
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