Ice-templating holds promise to become a powerful technique to construct high-performance bioinspired materials. Both ice nucleation and growth during the freezing process are crucial for the final architecture of the ice-templated material. However, effective ways to control these two very important factors are still lacking. Here, we demonstrate that successive ice nucleation and preferential growth can be realized by introducing a wettability gradient on a cold finger. A bulk porous material with a long-range lamellar pattern was obtained using a linear gradient, yielding a high-performance, bulk nacre-mimetic composite with excellent strength and toughness after infiltration. In addition, cross-aligned and circular lamellar structures can be obtained by freeze-casting on surfaces modified with bilayer linear gradient and radial gradient, respectively, which are impossible to realize with conventional freeze-casting techniques. Our study highlights the potential of harnessing the rich designability of surface wettability patterns to build high-performance bulk materials with bioinspired complex architectures.
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http://dx.doi.org/10.1126/sciadv.abb4712 | DOI Listing |
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January 2025
State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou, 730000, China.
Polymer composite materials encounter considerable challenges in sustaining superior tribological properties at high rotational speeds. Inspired by the microstructure of dragonfly wings, a novel thermally stable and ambient pressure curing poly(urea-imide) resin (PURI) with excellent tribological properties has been eco-friendly synthesis using bio-based greener solvents. Furthermore, The PURI composites enhanced with polyether ether ketone (PEEK) and Polytetrafluoroethylene (PTFE) blended fabrics demonstrate excellent mechanical, with tensile strengths exceeding 175 MPa.
View Article and Find Full Text PDFJ Mater Chem B
January 2025
Centre for 3D Models of Health and Disease, Division of Surgery and Interventional Science, Faculty of Medical Sciences, University College London, London, UK.
The significance of three-dimensional (3D) bioprinting in the domain of regenerative medicine and tissue engineering is readily apparent. To create a multi-functional bioinspired structure, 3D bioprinting requires high-performance bioinks. Bio-inks refer to substances that encapsulate viable cells and are employed in the printing procedure to construct 3D objects progressive through successive layers.
View Article and Find Full Text PDFProc Natl Acad Sci U S A
January 2025
Department of Chemistry and the Materials Research Center, Northwestern University, Evanston, IL 60208.
Human perception systems are highly refined, relying on an adaptive, plastic, and event-driven network of sensory neurons. Drawing inspiration from Nature, neuromorphic perception systems hold tremendous potential for efficient multisensory signal processing in the physical world; however, the development of an efficient artificial neuron with a widely calibratable spiking range and reduced footprint remains challenging. Here, we report an efficient organic electrochemical neuron (OECN) with reduced footprint (<37 mm) based on high-performance vertical OECT (vOECT) complementary circuitry enabled by an advanced n-type polymer for balanced p-/n-type vOECT performance.
View Article and Find Full Text PDFACS Appl Mater Interfaces
January 2025
School of Mechanical Engineering and Automation, Harbin Institute of Technology, Shenzhen, Shenzhen 518055, China.
Solar-driven interfacial evaporation is regarded as a green and sustainable strategy to address the global freshwater crisis. Nevertheless, it remains challenging to develop a photothermal structure with highly efficient evaporation under omnidirectional illumination. Herein, a three-dimensional multiscale pyramidal array photothermal structure (PAPS) was developed from the inspiration of durian skin.
View Article and Find Full Text PDFCommun Eng
January 2025
Guangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou, 510006, PR China.
Conventional electronic chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Here we propose and fabricate a closed high-conducting heat chip package based on passive phase change, using silicon carbide which is physically and structurally compatible with chip die materials. Our "chip on vapor chamber" (CoVC) concept realizes rapid diffusion of hot spots, and eliminates the high energy consumption of refrigeration ordinarily required for heat management.
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