Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing.

The analysis of thermal processes associated to the curing of adhesives and the study of mechanical behavior once cured, provide key information to choose the best option for any specific application. The proposed methodology for the curing characterization, based on thermal analysis and rheology, is described through the comparison of three commercial adhesives. The experimental techniques used here are Thermogravimetric Analysis (TGA), Differential Scanning Calorimetry (DSC) and Rheology. TGA provides information about the thermal stability and filler content, DSC allows the evaluation of some thermal events associated to the cure reaction and to thermal changes of the cured material when subjected to temperature changes. Rheology complements the information of the thermal transformations from a mechanical point of view. Thus, the curing reaction can be tracked through the elastic modulus (mainly the storage modulus), the phase angle and the gap. In addition, it is also shown that although DSC is of no use to study the curing of moisture curable adhesives, it is a very convenient method to evaluate the low temperature glass transition of amorphous systems.