In this paper, we combine inverse design concept and direct binary search algorithm to demonstrate three ultra-compact high efficiency and low crosstalk on-chip integrated optical interconnection basic devices in the entire wavelength range of 1,400-1600 nm based on silicon-on-insulator platform. A 90-degree waveguide bend with a footprint of only 2.4 × 2.4 μm is designed, whose transmission efficiency up to 0.18 dB. A waveguide crossing with a footprint of only 2.4 × 2.4 μm is designed, which can provide insertion loss of less than 0.5 dB and crosstalk (CL) of lower than - 19 dB. A same direction waveguide crossing with footprint of only 2.4 × 3.6 μm is designed, which can provide the insertion loss of less than 0.56 dB and the crosstalk of lower than - 21 dB. Then, we use them to form several ultra-compact optical interconnect basic structures and performed the simulation calculation. They overall achieve high performance. This will significantly improve the integration density.
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http://www.ncbi.nlm.nih.gov/pmc/articles/PMC7371873 | PMC |
http://dx.doi.org/10.1038/s41598-020-68936-w | DOI Listing |
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