The authors wish to make the following correction to this paper [1][...].
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http://dx.doi.org/10.3390/ma13112630 | DOI Listing |
Nanotechnology
January 2025
Universiti Teknologi PETRONAS, Centre of Innovative Nanostructures and Nanodevices (COINN), Universiti Teknologi PETRONAS, 32610 Seri Iskandar, Perak Darul Ridzuan, MALAYSIA, Seri Iskandar, Perak, 32610, MALAYSIA.
Most previously reported susceptors for microwave welding are in powder form. In this study, a thin-film susceptor was employed due to its uniform heating rate and ease of handling. Silicon carbide nanowhisker (SiCNW) were incorporated into a poly(methyl methacrylate) (PMMA) matrix to create a nanocomposite thin film, which served as the susceptor.
View Article and Find Full Text PDFMicromachines (Basel)
December 2024
Queensland Micro- and Nanotechnology Centre, Griffith University, Nathan Campus, 170 Kessels Road, Brisbane, QLD 4111, Australia.
The evaporation dynamics of sessile droplets on re-entrant microstructures are critical for applications in microfluidics, thermal management, and self-cleaning surfaces. Re-entrant structures, such as mushroom-like shapes with overhanging features, trap air beneath droplets to enhance non-wettability. The present study examines the evaporation of a water droplet on silicon carbide (SiC) and silicon dioxide (SiO) re-entrant structures, focusing on the effects of material composition and solid area fraction on volume reduction, contact angle, and evaporation modes.
View Article and Find Full Text PDFMaterials (Basel)
December 2024
Aerospace Research Institute of Materials and Processing Technology, Beijing 100076, China.
Carbon-fiber-reinforced carbon and silicon carbide (C/C-SiC) composites were prepared using chemical vapor infiltration (CVI) combined with reactive melt infiltration (RMI). The microstructure and flexural properties of C/C-SiC composites after oxidation in different temperature water vapor environments were studied. The results indicate that the difficulty of oxidation in water vapor can be ranked from easy to difficult in the following order: carbon fiber (CF), pyrolytic carbon (PyC), and ceramic phase.
View Article and Find Full Text PDFCommun Eng
January 2025
Guangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou, 510006, PR China.
Conventional electronic chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Here we propose and fabricate a closed high-conducting heat chip package based on passive phase change, using silicon carbide which is physically and structurally compatible with chip die materials. Our "chip on vapor chamber" (CoVC) concept realizes rapid diffusion of hot spots, and eliminates the high energy consumption of refrigeration ordinarily required for heat management.
View Article and Find Full Text PDFSci Rep
January 2025
Departemant of Physics and Energy Engineering, Amirkabir University of Technology, Tehran, Iran.
With careful design and integration, microring resonators can serve as a promising foundation for developing compact and scalable sources of non-classical light for quantum information processing. However, the current design flow is hindered by computational challenges and a complex, high-dimensional parameter space with interdependent variables. In this work, we present a knowledge-integrated machine learning framework based on Bayesian Optimization for designing squeezed light sources using microring resonators.
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