THE DIAMOND (D) IS ONE OF the most precious materials in the world with unmatched physical and chemical properties, such as hardness, extreme chemical stability, high thermal conductivity, the highest acoustic velocity of any material, an extremely low friction coefficient when smooth, and nearly unmatched biocompatibility [1]. The carbon (C) atoms in Ds are tetrahedrally coordinated, i.e., each C atom is bonded to four others in the D lattice. This bonding is referred to as bonding, and the strength and configuration of these bonds provide Ds with these unmatched fundamental properties and characteristics. Realizing these properties of the D in a C-based film that can easily be integrated into functional engineering systems and deployed in many applications has been a challenge for several decades. This is of primary concern in microelectronics, sensing, and hard-coating applications.

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http://www.ncbi.nlm.nih.gov/pmc/articles/PMC7250399PMC
http://dx.doi.org/10.1109/MNANO.2016.2572243DOI Listing

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