Severity: Warning
Message: file_get_contents(https://...@pubfacts.com&api_key=b8daa3ad693db53b1410957c26c9a51b4908&a=1): Failed to open stream: HTTP request failed! HTTP/1.1 429 Too Many Requests
Filename: helpers/my_audit_helper.php
Line Number: 176
Backtrace:
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 176
Function: file_get_contents
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 250
Function: simplexml_load_file_from_url
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 1034
Function: getPubMedXML
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 3152
Function: GetPubMedArticleOutput_2016
File: /var/www/html/application/controllers/Detail.php
Line: 575
Function: pubMedSearch_Global
File: /var/www/html/application/controllers/Detail.php
Line: 489
Function: pubMedGetRelatedKeyword
File: /var/www/html/index.php
Line: 316
Function: require_once
Effect of sandblasting of the copper electrode structures before deposition of gold thin film for micro electrical impedance tomography (EIT) system has been studied experimentally. The comparison has been performed on the unmodified copper electrodes and the sandblasted electrodes before deposition of gold layer, using structural analysis while their performance in EIT system has been measured and analyzed. The results of scanning electron microscopy and atomic force microscopy show that the sandblasting of the electrodes results in the deposition of gold film with smaller grain size and uniformly, comparing to the unmodified structure. The measurement of impedance shows that the sandblasting will increase the double layer capacitance of electrode structure which improves the impedance measurement accordingly.
Download full-text PDF |
Source |
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http://www.ncbi.nlm.nih.gov/pmc/articles/PMC7118304 | PMC |
http://dx.doi.org/10.1016/j.heliyon.2020.e03652 | DOI Listing |
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