Severity: Warning
Message: file_get_contents(https://...@pubfacts.com&api_key=b8daa3ad693db53b1410957c26c9a51b4908&a=1): Failed to open stream: HTTP request failed! HTTP/1.1 429 Too Many Requests
Filename: helpers/my_audit_helper.php
Line Number: 176
Backtrace:
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 176
Function: file_get_contents
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 250
Function: simplexml_load_file_from_url
File: /var/www/html/application/helpers/my_audit_helper.php
Line: 3122
Function: getPubMedXML
File: /var/www/html/application/controllers/Detail.php
Line: 575
Function: pubMedSearch_Global
File: /var/www/html/application/controllers/Detail.php
Line: 489
Function: pubMedGetRelatedKeyword
File: /var/www/html/index.php
Line: 316
Function: require_once
The process of solid-electrolyte interphase (SEI) formation is systematically investigated along with its chemical composition on carbon electrodes in an ionic liquid-based, Li-containing electrolyte in a combined surface science and electrochemical model study using highly oriented pyrolytic graphite (HOPG) and binder-free graphite powder electrodes (Mage) as model systems. The chemical decomposition process is explored by deposition of Li on a pre-deposited multilayer film of 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl)imide ([BMP][TFSI]) under ultrahigh vacuum conditions. Electrochemical SEI formation is induced by and monitored during potential cycling in [BMP][TFSI]+0.1 m LiTFSI. The chemical composition of the resulting layers is characterized by X-ray photoelectron spectroscopy (XPS), both at the surface and in deeper layers, closer to the electrode|SEI interface, after partial removal of the film by Ar ion sputtering. Clear differences between chemical and electrochemical SEI formation, and also between SEI formation on HOPG and Mage electrodes, are observed and discussed.
Download full-text PDF |
Source |
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http://www.ncbi.nlm.nih.gov/pmc/articles/PMC7317785 | PMC |
http://dx.doi.org/10.1002/cssc.202000495 | DOI Listing |
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