The fabrication of high-aspect-ratio metal micro device on metal substrate is largely limited by its poor interfacial adhesion strength between metal substrate and thick SU-8 photoresist mould. In this paper, ultrasonic treatment is introduced to improve the interfacial adhesion strength between metal substrate and a high-aspect-ratio inertial switch SU-8 mould. Firstly, a device for ultrasonic treatment was developed, ultrasonic vibration is applied to SU-8 film after post exposure baking in order to improve the interfacial adhesion strength. Compared with the traditional one, SU-8 photoresist mould treated by ultrasonic vibration can effectively improve the interfacial adhesion strength. After 90 min cavitation erosion test, SU-8 film treated by ultrasonic vibration remains 34.4% relative to nothing left of the SU-8 film without ultrasonic treatment. Besides, the mechanisms of ultrasonic treatment on improving interfacial adhesion strength are investigated. Finally, an inertial switch is successfully fabricated on metallic substrate with the ultrasonic treated SU-8 photoresist mould.

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http://dx.doi.org/10.1016/j.ultras.2020.106100DOI Listing

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