Recent Advances in Tin: From Two-Dimensional Quantum Spin Hall Insulator to Bulk Dirac Semimetal.

J Phys Chem Lett

Herbert Gleiter Institute of Nanoscience, College of Materials Science and Engineering , Nanjing University of Science and Technology, No. 200 Xiaolingwei , Nanjing 210094 , China.

Published: February 2020

AI Article Synopsis

  • Stanene, a two-dimensional topological insulator made of a single atomic layer of tin in a unique structure, has potential for room-temperature quantum-spin-Hall effects, attracting significant research interest.
  • The electronic characteristics of stanene and its parent Sn allotrope are influenced by lattice strain, leading to transformations in their properties based on substrate interactions, layer thickness, and strain.
  • This text reviews the essential properties of stanene and α-Sn films, recent progress in their growth techniques, the challenges faced in producing high-quality samples, and their potential applications.

Article Abstract

An atomic layer of tin in a buckled honeycomb lattice, termed stanene, is a promising large-gap two-dimensional topological insulator for realizing room-temperature quantum-spin-Hall effect and therefore has drawn tremendous interest in recent years. Because the electronic structures of Sn allotropes are sensitive to lattice strain, e.g. the semimetallic α-phase of Sn can transform into a three-dimensional topological Dirac semimetal under compressive strain, recent experimental advances have demonstrated that stanene layers on different substrates can also host various electronic properties relating to in-plane strain, interfacial charge transfer, layer thickness, and so on. Thus, comprehensive understanding of the growth mechanism at the atomic scale is highly desirable for precise control of such tunable properties. Herein, the fundamental properties of stanene and α-Sn films, recent achievements in epitaxial growth, challenges in high-quality synthesis, and possible applications of stanene are discussed.

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http://dx.doi.org/10.1021/acs.jpclett.9b03538DOI Listing

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