Kirigami-inspired multiscale patterning of metallic structures via predefined nanotrench templates.

Microsyst Nanoeng

1School of Physics and Electronics, State Key laboratory of Advanced Design and Manufacturing for Vehicle Body, Hunan University, 410082 Changsha, People's Republic of China.

Published: December 2019

AI Article Synopsis

  • The study focuses on improving the fabrication of metallic patterns needed for electronic and optical devices through a more efficient method inspired by the kirigami art of paper cutting.
  • This new process uses electron-beam patterning to create nanotrench contours in metallic films, allowing for reduced exposure time while achieving higher geometric precision compared to traditional methods.
  • The successful implementation of this technique enables the reliable creation of multiscale metallic structures, ranging from sub-10-nm to submillimeter features, opening doors for innovative applications like anti-counterfeiting and enhanced spectroscopy.

Article Abstract

Reliable fabrication of multiscale metallic patterns with precise geometry and size at both the nanoscale and macroscale is of importance for various applications in electronic and optical devices. The existing fabrication processes, which usually involve film deposition in combination with electron-beam patterning, are either time-consuming or offer limited precision. Inspired by the kirigami, an ancient handicraft art of paper cutting, this work demonstrates an electron-beam patterning process for multiscale metallic structures with significantly enhanced efficiency and precision. Similar to the kirigami, in which the final pattern is defined by cutting its contour in a paper and then removing the unwanted parts, we define the target multiscale structures by first creating nanotrench contours in a metallic film via an electron-beam-based process and then selectively peeling the separated film outside the contours. Compared with the conventional approach, which requires the exposure of the whole pattern, much less exposure area is needed for nanotrench contours, thus enabling reduced exposure time and enhanced geometric precision due to the mitigated proximity effect. A theoretical model based on interface mechanics allows a clear understanding of the nanotrench-assisted selective debonding behaviour in the peeling process. By using this fabrication process, multiscale metallic structures with sub-10-nm up to submillimetre features can be reliably achieved, having potential applications for anti-counterfeiting and gap-plasmon-enhanced spectroscopy.

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Source
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC6885514PMC
http://dx.doi.org/10.1038/s41378-019-0100-3DOI Listing

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