AlGaN-based deep ultraviolet (DUV) light-emitting diodes (LEDs) suffer from electron overflow and insufficient hole injection. In this paper, novel DUV LED structures with superlattice electron deceleration layer (SEDL) is proposed to decelerate the electrons injected to the active region and improve radiative recombination. The effects of several chirped SEDLs on the performance of DUV LEDs have been studied experimentally and numerically. The DUV LEDs have been grown by metal-organic chemical vapor deposition (MOCVD) and fabricated into 762 × 762 μm chips, exhibiting single peak emission at 275 nm. The external quantum efficiency of 3.43% and operating voltage of 6.4 V are measured at a forward current of 40 mA, indicating that the wall-plug efficiency is 2.41% of the DUV LEDs with ascending Al-content chirped SEDL. The mechanism responsible for this improvement is investigated by theoretical simulations. The lifetime of the DUV LED with ascending Al-content chirped SEDL is measured to be over 10,000 h at L50, due to the carrier injection promotion.
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http://dx.doi.org/10.1186/s11671-019-3201-x | DOI Listing |
Here, we systematically investigate the effect of mesa/sub-mesa sidewall engineering on single-junction (SJ) and high-voltage (HV) deep ultraviolet light-emitting diodes (DUV LEDs). The configuration of ∼46° inclined angle of the mesa/sub-mesa sidewall and Al reflector optimally promotes light extraction of SJ/HV DUV LEDs. We further observe substantial improvements in the self-heating and external quantum efficiency (EQE) droop effects of HV DUV LEDs with an increasing number of sub-mesas.
View Article and Find Full Text PDFIn this work, electrical and optical performances for 250 nm AlGaN-based flip-chip deep ultraviolet light emitting diodes (DUV LEDs) with different chip sizes are studied. Reduced chip size helps increase the light extraction efficiency (LEE) with the cost of increased surface nonradiative recombination. Nevertheless, a thin p-AlGaN layer of 10 nm can manage current distribution while suppressing surface recombination and reducing light absorption simultaneously, which results in the increased optical power density.
View Article and Find Full Text PDFThe current low external quantum efficiency (EQE) of deep ultraviolet (DUV) LEDs and micro-LEDs is largely attributed to their low light extraction efficiency (LEE). To address this issue and increase the LEE of DUV devices, various strategies such as reducing size, modifying surface with nanostructures and roughening substrates have been proposed. While some studies have investigated the effects of nanopillar and size on DUV LED, there remains a lack of systematic research on the LEE enhancement mechanism across different wavelengths and sizes of DUV LEDs, micro-LEDs, and nano-LEDs.
View Article and Find Full Text PDFNanomaterials (Basel)
November 2024
Southern Polytechnic College of Engineering and Engineering Technology, Kennesaw State University, Marietta, GA 30060, USA.
AlGaN is attractive for fabricating deep ultraviolet (DUV) optoelectronic and electronic devices of light-emitting diodes (LEDs), photodetectors, high-electron-mobility field-effect transistors (HEMTs), etc. We investigated the quality and optical properties of AlGaN films with high Al fractions (60-87%) grown on sapphire substrates, including AlN nucleation and buffer layers, by metal-organic chemical vapor deposition (MOCVD). They were initially investigated by high-resolution X-ray diffraction (HR-XRD) and Raman scattering (RS).
View Article and Find Full Text PDFThe reactive ion etching (RIE) process is needed to fabricate deep ultraviolet (DUV) light-emitting diodes (LEDs). However, the n-contact performance deteriorates when the high-Al n-AlGaN surface undergoes RIE, leading to decreased LED performance. In this study, we employed an atomic layer etching (ALE) technology to eliminate surface damage generated during the mesa etching process, thus enhancing the n-AlGaN ohmic contact.
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