Herein, we report an atomic layer deposition (ALD) process for CuO thin films using copper(II) acetate [Cu(OAc)] and water vapor as precursors. This precursor combination enables the deposition of phase-pure, polycrystalline, and impurity-free CuO thin films at temperatures of 180-220 °C. The deposition of Cu(I) oxide films from a Cu(II) precursor without the use of a reducing agent is explained by the thermally induced reduction of Cu(OAc) to the volatile copper(I) acetate, CuOAc. In addition to the optimization of ALD process parameters and characterization of film properties, we studied the CuO films in the fabrication of photoconductor devices. Our proof-of-concept devices show that approximately 20 nm thick CuO films can be used for photodetection in the visible wavelength range and that the thin film photoconductors exhibit improved device characteristics in comparison to bulk CuO crystals.
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| http://www.ncbi.nlm.nih.gov/pmc/articles/PMC6648912 | PMC |
| http://dx.doi.org/10.1021/acsomega.9b01351 | DOI Listing |
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