An improved 4H-SiC metal semiconductor field effect transistor (MESFET) based on the double-recessed MESFET (DR-MESFET) for high power added efficiency (PAE) is designed and simulated in this paper and its mechanism is explored by co-simulation of ADS and ISE-TCAD software. This structure has a partially low doped channel (PLDC) under the gate, which increases the PAE of the device by decreasing the absolute value of the threshold voltage (), gate-source capacitance () and saturation current (). The simulated results show that with the increase of , the PAE of the device increases and then decreases when the value of is low enough. The doping concentration and thickness of the PLDC are respectively optimized to be = 1 × 10 cm and = 0.15 μm to obtain the best PAE. The maximum PAE obtained from the PLDC-MESFET is 43.67%, while the PAE of the DR-MESFET is 23.43%; the optimized PAE is increased by 86.38%.
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http://dx.doi.org/10.3390/mi10090555 | DOI Listing |
Low kerf-loss and high surface quality silicon carbide (SiC) wafer slicing is key to reducing cost, improving productivity, and extending industrial applications. In this paper, a novel all-laser processing approach is proposed by combining laser micro-cracks generation and growth manipulation. The first high fluence pulsed laser is applied to generate micro-cracks inside SiC, which increases its laser energy absorption.
View Article and Find Full Text PDFPhys Chem Chem Phys
November 2024
Institute of Microsystems, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan, Hubei Province, 430074, P. R. China.
Determination of chemical effects involved in material removal during the polishing process of 4H-SiC has been a challenge. In this study, the polishing processes of 4H-SiC under the action of diamond and SiO abrasive in different concentrations of HO solutions are investigated by reactive force field molecular dynamics simulations. It is found that 4H-SiC can be oxidized by HO solution at the atomic scale, but the chemical reaction alone does not lead to material removal.
View Article and Find Full Text PDFNano Lett
August 2024
Institute of Micro/Nano Electromechanical System and Integrated Circuit, College of Mechanical Engineering, Donghua University, Shanghai 201620, People's Republic of China.
4H-silicon carbide (4H-SiC) possesses a high Baliga figure of merit, making it a promising material for power electronics. However, its applications are limited by low hole mobility. Herein, we found that the hole mobility of 4H-SiC is mainly limited by the strong interband electron-phonon scattering using mode-level first-principles calculations.
View Article and Find Full Text PDFMicromachines (Basel)
July 2024
Department of Electrical Engineering, Xi'an University of Technology, Xi'an 710048, China.
A silicon carbide (SiC) SGT MOSFET featuring a ""-shaped P+ shielding region (PSR), named SPDT-MOS, is proposed in this article. The improved PSR is introduced as a replacement for the source trench to enhance the forward performance of the device. Its improvement consists of two parts.
View Article and Find Full Text PDFMicromachines (Basel)
June 2024
State Key Laboratory of Wide-Bandgap Semiconductor Devices and Integrated Technology, School of Microelectronics, Xidian University, Xi'an 710071, China.
This paper presents a comprehensive study on single- and repetitive-frequency UIS characteristics of 1200 V asymmetric (AT) and double trench silicon carbide (DT-SiC) metal-oxide-semiconductor field-effect transistors (MOSFETs) and their electrical degradation under electrical-thermal working conditions, investigated through experiment and simulation verification. Because their structure is different, the failure mechanisms are different. Comparatively, the gate oxide of a DT-MOSFET is more easily damaged than an AT-MOSFET because the hot carriers are injected into the oxide.
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