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Nanophotonic structures energized short-wave infrared quantum dot photodetectors and their advancements in imaging and large-scale fabrication techniques.
Nanoscale
December 2024
Department of Electronic and Electrical Engineering, Southern University of Science and Technology, Shenzhen, 518055, China.
Short-wave infrared (SWIR) photodetectors (PDs) have a wide range of applications in the field of information and communication. Especially in recent years, with the increasing demand for consumer electronics, conventional semiconductor-based PDs alone are unable to cope with the ever-increasing market. Colloidal quantum dots (QDs) have attracted great interest due to their low fabrication cost, solution processability, and promising optoelectronic properties.
View Article and Find Full Text PDFFully printed zero-static power MoS switch coded reconfigurable graphene metasurface for RF/microwave electromagnetic wave manipulation and control.
Nat Commun
December 2024
Department of Electrical and Electronics, University of Manchester, Manchester, M13 9PL, UK.
Article Synopsis
- Modern electronic devices aim to reduce power consumption, focusing on zero-static power switches that can maintain their state without external voltage, though their implementation is slow due to materials compatibility with CMOS technology.* -
- Printable technology offers low-cost manufacturing at room temperature, allowing for the integration of devices onto flexible substrates, which is beneficial in creating new electronic applications.* -
- The study demonstrates that printed Ag/MoS/Ag heterostructures can function as zero-static switches and create reconfigurable metasurfaces for various applications, including wireless communication and sensing, while also indicating that MoS phase changes may enhance Ag diffusion.*
Ultrathin α-BiO Thin-Film Transistor for Cost-Effective Oxide-TFT Inverters.
ACS Appl Mater Interfaces
November 2024
Material Science and Engineering Program, University of California San Diego, La Jolla, California 92093, United States.
Electronics is advancing toward greater diversity and sustainability by prioritizing energy efficiency and cost-effectiveness. Metal oxide thin-film transistor (TFT) represents a technology at the forefront of advancing next-generation sustainable electronics, and exploring oxide channel compositions is a crucial step in opening opportunities for developing next-generation device applications. This study presents the first development of n-channel α-BiO-TFTs using a 4 nm ultrathin channel prepared by a cost-effective vacuum-free and solvent-free liquid metal printing method in ambient air.
View Article and Find Full Text PDFRecent Advances in Metal-Oxide-Based Photoresists for EUV Lithography.
Micromachines (Basel)
August 2024
Department of Microsystems, University of South-Eastern Norway, 3184 Horten, Norway.
Extreme ultraviolet lithography (EUVL) is a leading technology in semiconductor manufacturing, enabling the creation of high-resolution patterns essential for advanced microelectronics. This review highlights recent progress in inorganic metal-oxide-based photoresists, with a focus on their applications in EUVL. The unique properties of zinc-based, tin-oxygen, and IVB group inorganic photoresists are examined, showcasing their enhanced chemical reactivity and precise patterning capabilities.
View Article and Find Full Text PDFMicrofluidic Lab-on-CMOS Packaging Using Wafer-Level Molding and 3D-Printed Interconnects.
IEEE Trans Biomed Circuits Syst
August 2024
Lab-on-a-chip (LoC) technologies continue to promise lower cost and more accessible platforms for performing biomedical testing in low-cost and disposable form factors. Lab-on-CMOS or lab-on-microchip methods extend this paradigm by merging passive LoC systems with active complementary metal-oxide semiconductor (CMOS) integrated circuits (IC) to enable front-end signal conditioning and digitization immediately next to sensors in fluid channels. However, integrating ICs with microfluidics remains a challenge due to size mismatch and geometric constraints, such as non-planar wirebonds or flip-chip approaches in conflict with planar microfluidics.
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