Connection between Carbon Incorporation and Growth Rate for GaN Epitaxial Layers Prepared by OMVPE.

Materials (Basel)

Department of Materials Science and Engineering, Virginia Tech, Blacksburg, VA 24061, USA.

Published: August 2019

AI Article Synopsis

  • Carbon is naturally present in the OMVPE process used to grow GaN, impacting its properties.
  • The study investigates how different growth conditions affect carbon incorporation in GaN, finding that consistent ammonia molar flows lead to similar carbon levels regardless of growth efficiency.
  • A new approach using ammonia molar flow relative to growth rate is proposed as a better predictor for carbon incorporation compared to the traditional V/III ratio, achieving a low carbon concentration of 7.3 × 10 atoms/cm.

Article Abstract

Carbon, a compensator in GaN, is an inherent part of the organometallic vapor phase epitaxy (OMVPE) environment due to the use of organometallic sources. In this study, the impact of growth conditions are explored on the incorporation of carbon in GaN prepared via OMVPE on pseudo-bulk GaN wafers (in several cases, identical growths were performed on GaN-on-AlO templates for comparison purposes). Growth conditions with different growth efficiencies but identical ammonia molar flows, when normalized for growth rate, resulted in identical carbon incorporation. It is concluded that only trimethylgallium which contributes to growth of the GaN layer contributes to carbon incorporation. Carbon incorporation was found to decrease proportionally with increasing ammonia molar flow, when normalized for growth rate. Ammonia molar flow divided by growth rate is proposed as a reactor independent predictor of carbon incorporation as opposed to the often-reported input V/III ratio. A low carbon concentration of 7.3 × 10 atoms/cm (prepared at a growth rate of 0.57 µm/h) was obtained by optimizing growth conditions for GaN grown on pseudo-bulk GaN substrates.

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Source
http://www.ncbi.nlm.nih.gov/pmc/articles/PMC6695831PMC
http://dx.doi.org/10.3390/ma12152455DOI Listing

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