In this research, the corrosion behavior of printed circuit boards with an immersion silver layer (PCB-ImAg) exposed to bacteria in Luria-Bertani broth was investigated. The growth test demonstrated that had a high copper tolerance. Analysis of surface and cross-sectional view of the samples after immersion test indicated that metabolites produced by accelerated the microporous corrosion of PCB-ImAg, and the biofilm that adhered to the surface led to oxygen concentration corrosion. Electrochemical impedance spectroscopy tests confirmed that the microbiologically influenced corrosion of PCB-ImAg was related to the biofilm formation and metabolism.
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http://dx.doi.org/10.3389/fmicb.2019.01493 | DOI Listing |
Biomed Eng Lett
January 2025
MicroSystems Lab (µSL), School of Computer and Systems Sciences, Jawaharlal Nehru University, New Delhi, 110067 India.
This paper demonstrates real-time, label-free, contact-based glucose sensor design of inset-fed Microstrip Patch Antenna (MSPA) genres: Slotted Microstrip Patch Antenna (SMSPA) and Through-hole Microstrip Patch Antenna (THMSPA). In SMSPA, multiple slots are created along the width edge of the patch. In THMSPA, a through-hole is introduced across the antenna including all the layers: patch, substrate and ground conductor of the MSPA.
View Article and Find Full Text PDFLab Chip
January 2025
Institute of Translational Medicine, Department of Health Sciences and Technology, ETH Zürich, 8092 Zürich, Switzerland.
Proteases, an important class of enzymes that cleave proteins and peptides, carry a wealth of potentially useful information. Devices to enable routine and cost effective measurement of their activity could find frequent use in clinical settings for medical diagnostics, as well as some industrial contexts such as detecting on-line biological contamination. In particular, devices that make use of readouts involving magnetic particles may offer distinct advantages for continuous sensing because material they release can be magnetically captured downstream and their readout is insensitive to optical properties of the sample.
View Article and Find Full Text PDFMicromachines (Basel)
November 2024
Instituto Nacional de Astrofísica, Óptica y Electrónica-INAOE, Puebla 72840, Mexico.
This work presents the design, fabrication, and rigorous validation of a flexible, wireless, capacitive pressure sensor for the full-range continuous monitoring of ventricular pressure. The proposed system consists of an implantable set and an external readout device; both modules were designed to form an RCL resonant circuit for passive, wireless pressure sensing and signal retrieving. Using surface micromachining and flexible electronics techniques, a two-variable capacitor array and a dual-layer planar coil were integrated into a flexible ergonomic substrate, avoiding hybrid-like connections in the implantable set.
View Article and Find Full Text PDFMaterials (Basel)
December 2024
National Materials Corrosion and Protection Data Center, University of Science and Technology Beijing, Beijing 100083, China.
Copper foil is widely used in electronic components and devices. This study investigates the corrosion behavior of copper foil on printed circuit boards exposed for one year in a closed atmospheric environment across 22 different sites in the Sichuan-Tibet region. Through electrochemical, SEM/EDS, and XRD analyses, the corrosion behavior of copper foil material across the five selected sites (Meishan, Mangkang, Luding, Batang, and Panzhihua) and the influence of environmental factors were discussed.
View Article and Find Full Text PDFWaste Manag
January 2025
Helmholtz-Zentrum Dresden-Rossendorf, Helmholtz-Institute Freiberg for Resource-Technology, Freiberg, Germany.
Printed circuit boards represent an extraordinarily challenging fraction for the recycling of waste electric and electronic equipment. Due to the closely interlinked structure of the composing materials, the selective recycling of copper and closely associated precious metals from this composite material is compromised by losses during mechanical pre-processing. This problem could partially be overcome by a better understanding of the influence of particle size and shape on the recovery of finely comminuted and well-liberated metal particles during mechanical separation.
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