High-entropy alloys (HEAs) are promising materials for next-generation applications because of their mechanical properties, excellent high-temperature stability, and resistance against oxidation and corrosion. Although many researchers have investigated high-temperature HEA applications, few have considered low-temperature applications. Here we demonstrate an unprecedented intermetallic compound of (Fe, Cr, Co, Ni, Cu)Sn at the interface between Sn-3.0Ag-0.5Cu (SAC) solder and FeCoNiCrCu HEA substrate after reflow at 400 °C. Significantly suppressed growth of intermetallic compound without detachment from the substrate was observed during thermal aging at 150 °C for 150 h. Sn grains with an average grain size of at least 380 μm are observed. The results reveal a completely new application for the fields of Sn-Ag-Cu solder and HEA materials.
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| http://www.ncbi.nlm.nih.gov/pmc/articles/PMC6629638 | PMC |
| http://dx.doi.org/10.1038/s41598-019-46757-w | DOI Listing |
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