In this study, hydrogen peroxide (HO) cosolvent, which was dissolved into supercritical-phase carbon dioxide fluid (SCCO), is employed to passivate excessive oxygen vacancies of the high-mobility tungsten-doped indium oxide without any essential thermal process. With the detailed material analysis, the internal physical mechanism of the cosolvent effect or the interaction between the cosolvent solution and supercritical-phase fluid is well discussed. In addition, the optimized result has been applied for the thin film transistor device fabrication. As a result, the device with SCCO + HO treatment exhibits the lowest subthreshold swing of 82 mV/dec, the lowest interface trap density of 8.76 × 10 eV cm, the lowest hysteresis of 47 mV, and an excellent reliability and uniformity characteristic compared with any other control groups. Besides, an extremely high field-effect mobility of 98.91 cm/V s can also be observed, while there is even a desirable positive shift for the threshold voltage. Notably, compared with the untreated sample, the highest on/off current ratio of 5.11 × 10 can be achieved with at least four orders of magnitude enhancement by this unique treatment.

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http://dx.doi.org/10.1021/acsami.9b04257DOI Listing

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In this study, hydrogen peroxide (HO) cosolvent, which was dissolved into supercritical-phase carbon dioxide fluid (SCCO), is employed to passivate excessive oxygen vacancies of the high-mobility tungsten-doped indium oxide without any essential thermal process. With the detailed material analysis, the internal physical mechanism of the cosolvent effect or the interaction between the cosolvent solution and supercritical-phase fluid is well discussed. In addition, the optimized result has been applied for the thin film transistor device fabrication.

View Article and Find Full Text PDF

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