The vertical double β-barrel major capsid protein (MCP) fold, fingerprint of the PRD1-adeno viral lineage, is widespread in many viruses infecting organisms across the three domains of life. The discovery of PRD1-like viruses with two MCPs challenged the known assembly principles. Here, we present the cryo-electron microscopy (cryo-EM) structures of the archaeal, halophilic, internal membrane-containing Haloarcula californiae icosahedral virus 1 (HCIV-1) and Haloarcula hispanica icosahedral virus 2 (HHIV-2) at 3.7 and 3.8 Å resolution, respectively. Our structures reveal proteins located beneath the morphologically distinct two- and three-tower capsomers and homopentameric membrane proteins at the vertices that orchestrate the positioning of pre-formed vertical single β-barrel MCP heterodimers. The cryo-EM based structures together with the proteomics data provide insights into the assembly mechanism of this type of viruses and into those with membrane-less double β-barrel MCPs.
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http://dx.doi.org/10.1038/s41467-019-08927-2 | DOI Listing |
Adv Mater
January 2025
School of Materials Science and Engineering, Key Laboratory of Advanced Materials and Devices for Post-Moore Chips, Ministry of Education, University of Science and Technology Beijing, Beijing, 100083, China.
Magnetic antiskyrmions, the anti-quasiparticles of magnetic skyrmions, possess alternating Bloch- and Néel-type spin spirals, rendering them promising for advanced spintronics-based information storage. To date, antiskyrmions are demonstrated in a few bulk materials featuring anisotropic Dzyaloshinskii-Moriya interactions and a limited number of artificial multilayers. Identifying novel film materials capable of hosting isolated antiskyrmions is critical for memory applications in topological spintronics.
View Article and Find Full Text PDFNano Lett
January 2025
Department of Physics, Washington University in St. Louis, St. Louis, Missouri 63130, United States.
Recent studies have demonstrated the ability to switch weakly coupled interlayer magnetic orders by using electric polarization in insulating van der Waals heterostructures. However, controlling strongly coupled intralayer magnetic orders remains a significant challenge. In this work, we propose that frustrated multiferroic heterostructures can exhibit enhanced intralayer magnetoelectric coupling.
View Article and Find Full Text PDFNat Commun
January 2025
Department of Electrical Engineering, University of California, Irvine, CA, USA.
Complementary transistors are critical for circuits with compatible input/output signal dynamic range and polarity. Organic electronics offer biocompatibility and conformability; however, generation of complementary organic transistors requires introduction of separate materials with inadequate stability and potential for tissue toxicity, limiting their use in biomedical applications. Here, we discovered that introduction of source/drain contact asymmetry enables spatial control of de/doping and creation of single-material complementary organic transistors from a variety of conducting polymers of both carrier types.
View Article and Find Full Text PDFAnal Chim Acta
January 2025
Center for Quantum Sciences and School of Physics, Northeast Normal University, Changchun, 130117, China.
Background: Adrenaline and glucose are essential biomarkers in human body for maintaining metabolic balance. Abnormal levels of adrenaline and glucose are associated with various diseases. Therefore, it is important to design portable, on-site devices for rapid adrenaline and glucose analysis to safeguard health.
View Article and Find Full Text PDFNpj Flex Electron
October 2024
Thayer School of Engineering, Dartmouth College, Hanover, NH, 03755, USA.
The integration of flexible electronics and photonics has the potential to create revolutionary technologies, yet it has been challenging to marry electronic and photonic components on a single polymer device, especially through high-volume manufacturing. Here, we present a robust, chiplet-level heterogeneous integration of polymer-based circuits (CHIP), where several post-fabricated, ultrathin, polymer electronic, and optoelectronic chiplets are vertically bonded into one single chip at room temperature and then shaped into application-specific form factors with monolithic Input/Output (I/O). As a demonstration, we applied this process and developed a flexible 3D-integrated optrode with high-density arrays of microelectrodes for electrical recording and micro light-emitting diodes (μLEDs) for optogenetic stimulation while with unprecedented integration of additional temperature sensors for bio-safe operations and shielding designs for optoelectronic artifact prevention.
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